ESC & Pedestal Design Ownership: Lead concept through release for ESC/pedestal assemblies, including ceramic puck, aluminum base, cooling channels, backside-gas distribution, seal bands, lift-pin features, RF/DC feed interfaces, insulators, cables, and service interfaces. Design for Reliability: Identify and mitigate failure modes such as ceramic cracking, bond delamination, CTE-mismatch stress, helium leakage, MCA/mesa wear, high leakage current, corrosion, backside ignition, residual charge, and chucking/de-chucking instability.