Knowledge, Skills and Competencies: Basic understanding of surface mount and microelectronic chip-and-wire manufacturing methods and techniques, including soldering, wedge bonding, silver epoxy application, expansion coefficient and thermal conductivity of materials, plating, hard and soft substrate materials, printed circuit board manufacturing methods and techniquesMeasurement of RF, thermal and electrical characteristics for RF Power Amplifiers such as Linearity, Power, Efficiency, NF, Thermal Scans, etc. Provide meaningful bench data ensuring all elements of the applicable product specifications/requirements are tested and verifiedProvide test strategy and implementation plan for all types of relevant products (power amplifiers, low noise amplifiers, mixers, and various passive components such as baluns, power splitters, etc.).