Design high‑speed digital board‑level architectures (high‑density interconnects (HDI), multi‑layer Printed Circuit Boards (PCBs), high‑speed serial links, RF‑data converter interfaces) including signal‑integrity, power‑integrity, and EMI/EMC mitigation to guarantee reliable operation across temperature extremes, vibration, vacuum, and radiation environments. Coordinate and support test and verification activities using VNAs, spectrum analyzers, phase‑noise testers, OTA ranges, and high‑speed oscilloscopes; analyze results, drive design iterations, and confirm that all performance and qualification targets are met for hostile‑environment operation.