Design mixed-signal circuits for 2D/3D vision sensors, including image sensor interfaces, high-speed digital (MIPI CSI-2, LVDS, GigE/10GigE, USB3, PCIe), FPGA/SoC carrier boards, laser and LED strobe drivers, low-noise power, and trigger and encoder inputs. This includes camera and sensor boards, laser and LED illumination drivers, motion and trigger interfaces, and the power and I/O that connect our inspection heads to production lines.