Manufacture high-mix, medium-volume, high-frequency RF products using high-precision tools/processes, semiconductor dies, and automated ball bonding techniques to achieve aggressive production targets. Verify processes using metrology tools (e.g., CSAM, X-ray, 3D profilometers, pull/shear testers, contact angle goniometers) to assess epoxy voids, wirebond loop heights, and pull/shear forces.