Experience with physical analysis methods: cross‑sectioning, polishing (die-level), decapsulation (wet/plasma), optical microscopy, SEM/EDX; familiarity with FIB, TEM Demonstrated ability to perform systematic root‑cause analysis linking device‑level failure mechanisms (e.g., EOS/ESD, TDDB, HCI, electromigration, corrosion) to circuit and system behavior. Rivian may use your Candidate Personal Data for the purposes of (i) tracking interactions with our recruiting system; (ii) carrying out, analyzing and improving our application and recruitment process, including assessing you and your application and conducting employment, background and reference checks; (iii) establishing an employment relationship or entering into an employment contract with you; (iv) complying with our legal, regulatory and corporate governance obligations; (v) recordkeeping; (vi) ensuring network and information security and preventing fraud; and (vii) as otherwise required or permitted by applicable law.