Preferred experience (I'm not sure if this should go into the req or not?): 2+ years' hands-on experience in electrical component failure analysis including techniques such as CSAM, hotspot, de-processing (chemical, laser and/or plasma), mechanical cross section / polish, SEM and EDX (alternatively, experience with similar processes in wafer fabrication or packaging facility, or for cleaning or etching, may also be beneficial). The Day-to-Day (4-5 bullet points about what this person is responsible for): Supports engineering activities such as design, test, check-out, modification, fabrication and assembly of prototype electro mechanical systems, experimental design circuitry, laser/light transmission devices or specialized test equipment.