In this high-impact role, you will pioneer breakthrough silicon interface probing & test solutions that enable best-in-class die and wafer sort capabilities across leading-edge process nodes and advanced heterogeneous packaging platforms - including EMIB, EMIB-T, Foveros, and Foveros Direct. Our Advanced Packaging, Test and Manufacturing (APTM) organization is at the forefront of this transformation, delivering industry-leading packaging and test technologies that power products across Client, Data Center, AI, Networking, and External Foundry markets.