Keywords: Thermomechanical, thermal engineering, CFD, computational fluid dynamics, thermal simulation, thermal modeling, ANSYS Fluent, Ansys AEDT, ANSYS Icepak, STAR-CCM+, FloEFD, FloTHERM, FloTHERM XT, Simcenter 3D, COMSOL, OpenFOAM, conjugate heat transfer, CHT, fluid mechanics, heat transfer, pressure drop, flow distribution, liquid cooling, direct liquid cooling, DLC, direct-to-chip cooling, cold plate, microchannel, jet impingement, manifold, CDU, FWS, TCS, quick disconnect, QD, heat exchanger, high heat flux, high power density, server cooling, rack cooling, AI accelerator, GPU, CPU, data center, OCP, ORV3, Open Rack Wide, thermomechanical design, thermal validation, mechanical design, DFM, tolerance analysis, ODM, OEM, JDM. ODM/OEM partnership: close working relationships with ODMs and OEMs across the server/rack ecosystem - joint design (JDM), manufacturing readiness, BOM and supply alignment, and executive-level partner management.