RESPONSIBILITIES: Partner deeply with responsible engineers, signal-integrity, power, and packaging teams to co-define commodity strategy, multi-year technology roadmaps, and approved vendor lists for board mechanicals and connectors - high-speed I/O (OSFP, OSFP-XD, QSFP-DD, PCIe CEM, MCIO, SlimSAS, backplane and mezzanine), power connectors (including 48V, blind-mate, and busbar interfaces), CPU and accelerator sockets, DIMM sockets, cages and EMI hardware, standoffs, latches, ejectors, retention backplates, and related board-level mechanicals- anticipating SpaceXAI interconnect and density requirements 12-24 months ahead. Own global sourcing end-to-end for connectors and board mechanicals, including supplier selection, qualification, dual/multi-sourcing on constrained high-speed and socket SKUs, capacity reservation, and performance governance to achieve on-time delivery and continuous lead-time compression while supporting SpaceX's aggressive cluster build cadence.