Packaging Engineering Lead J&J Snack FoodsPackaging Engineering LeadLa Vergne, TennesseeAs a leader and innovator in the snack food industry for over 50 years, J&J Snack Foods provides branded snack foods to foodservice and retail supermarket outlets across the U.S. Its products include such icons as SUPERPRETZEL, ICEE, and Dippin’ Dots along with other key brands like LUIGI’S Real Italian Ice, The Funnel Cake Factory Funnel Cakes, and Hola Churros. Operating in a fast-paced consumer packaged goods environment, this role partners closely with R&D, Operations, Supply Chain, Marketing, Procurement, and other cross-functional teams to deliver innovative, cost-effective, sustainable, and automation-ready packaging solutions.
Structural Packaging & Retail Display Specialist (Remote) FuseGlobalStructural Packaging & Retail Display Specialist (Remote)RemoteDeliver temporary promotional packaging materials and temporary, pre-packed retail merchandise vehicles that can withstand supply chain handling and assure visual impact through product presentation that adheres to each customers guidelines and exceeds the expectations of marketing, factories, purchasing, quality assurance, co-packers, customers, and shoppers. They develop concepts and design specs, provide advice on artwork based on printing methods, generate promotional packaging specifications, test for structural integrity, manage supplier and co-packer relationships and interface with various internal and external groups to take each project to market.
Director of Advanced Packaging Process Engineering SkyWater Technology IncDirector of Advanced Packaging Process EngineeringKissimmee, FL$184,400–$276,600 / yearWe are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. In addition, they will closely collaborate with the Advanced Technology Services and Advanced Packaging Development Teams to create new manufacturing processes and capabilities, enabling the next generation of exciting new products to be manufactured at SkyWater.
Director of Advanced IC Packaging Development Renesas Electronics CorpDirector of Advanced IC Packaging DevelopmentSan Jose, CAWith a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. This role is pivotal in enabling the AI and Datacenter revolution by developing cutting-edge Smart Power Stages, Vertical Power Stages, Power Modules and Wide Bandgap (SiC/GaN) solutions.
Production Supervisor (packaging) 2nd shift Kao Canada IncProduction Supervisor (packaging) 2nd shiftCincinnati, OH$70,000–$80,000 / yearSkip to main contentKaoOpen main menuJobs HomeJobsManufacturingProduction Supervisor (packaging) 2nd shiftProduction Supervisor (packaging) 2nd shift Production Supervisor (packaging) 2nd shift Founded in Japan in 1887, Kao is passionate about making a difference in people's lives with our high quality products and services to create a Kirei Life for all - a beautiful life that respects the needs of our consumers and customers as well as the planet. Want to learn more: If you feel you are as unique as our products and want to find out why 33,000 people across the globe opted for a career with us please visit our Americas website ( https://www.kao.com/americas/en/ ).
NewPackaging & Filling Operator (Night Shift) Axalta Coating SystemsPackaging & Filling Operator (Night Shift)Orrville, OhioAxalta operates its business in two segments: Performance Coatings and Mobility Coatings, which serve four end markets, including Refinish, Industrial, Light Vehicle and Commercial Vehicle, across North America, EMEA, Latin America and Asia-Pacific. We've recently set an exciting 2040 carbon neutrality goal, in addition to 10 other sustainability initiatives, and we take pride in working with our customers to optimize their businesses and achieve their goals.
NewPackaging & Filling Operator (Day Shift) AxaltaPackaging & Filling Operator (Day Shift)Akron, OhioAxalta operates its business in two segments: Performance Coatings and Mobility Coatings, which serve four end markets, including Refinish, Industrial, Light Vehicle and Commercial Vehicle, across North America, EMEA, Latin America and Asia-Pacific. We’ve recently set an exciting 2040 carbon neutrality goal, in addition to 10 other sustainability initiatives, and we take pride in working with our customers to optimize their businesses and achieve their goals.
NewPackaging & Filling Operator (Day Shift) Axalta Coating SystemsPackaging & Filling Operator (Day Shift)Orrville, OhioAxalta operates its business in two segments: Performance Coatings and Mobility Coatings, which serve four end markets, including Refinish, Industrial, Light Vehicle and Commercial Vehicle, across North America, EMEA, Latin America and Asia-Pacific. Axalta operates its business in two segments: Performance Coatings and Mobility Coatings, which serve four end markets, including Refinish, Industrial, Light Vehicle and Commercial Vehicle, across North Ameri
Chip Packaging Architect GoogleChip Packaging ArchitectSunnyvale, CAYou will collaborate with product architects, design teams, and Signal Integrity/Power Integrity (SI/PI), thermal, mechanical, assembly, and Printed Circuit Board (PCB) engineers to create high-performance packages. As a Chip Packaging Architect on our Silicon Integration team, you will drive advanced packaging solutions (2.5D/3D/3.5D) and technologies for Machine Learning (ML) chips and custom Application-Specific Integrated Circuits (ASICs).
Packaging Designer Foth & Van Dyke LLCPackaging DesignerGreen Bay, WIFoth is currently seeking a team-focused, innovative, and results-oriented Project Packaging Designer who is looking for new learning experiences, opportunities for career growth, and a desire to contribute to our clients'' success. Artificial Intelligence: Foth uses artificial intelligence and other technology-assisted tools in connection with parts of our recruiting and hiring process, including to assist with reviewing application materials, identifying potentially qualified candidates, sourcing candidates, and supporting interview preparation.
Sr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions - (Advanced Packaging) (E) KLA CorpSr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions - (Advanced Packaging) (E)Milpitas, CA$138,500–$235,500 / yearMinimum 10+ years of experience in semiconductor manufacturing, product marketing, product management, applications engineering, yield engineering, process control, or related technical commercial roles. Doctorate (Academic) Degree and related work experience of 3 years; Master's Level Degree and related work experience of 6 years; Bachelor's Level Degree and related work experience of 8 years.
Market Development Engineer Kuraray AmericaMarket Development EngineerPasadena, TXFull timeEvaluate product performance, market impact, and customer or brand owner ROI.Minimum Qualifications:Bachelor's degree in Chemical Engineering, Food Engineering, Packaging Engineer,Polymer Science, Plastics Engineering, Materials Science, or Mechanical Engineering or other related degreeMinimum 3 years of experience in packaging, with direct experience collaborating with brandsKnowledge of business development, technical marketing, and customer-facing technical roles within the U.S. packaging market. Partner with Marketing Communications to develop publications, technical articles, and promotional content, coordinating approvals locally and globally (including with Kuraray Japan).Food Science & Application InnovationApply packaging expertise to assess food aging, oxygen and moisture sensitivity, recommend optimized packaging structures using the EVAL portfolio, and conduct food stability and shelf-life studies to support customer applications.
Software Engineer III, Infrastructure, Core Google LLCSoftware Engineer III, Infrastructure, CoreSunnyvale, CAWe"re looking for engineers who bring fresh ideas from all areas, including information retrieval, distributed computing, large-scale system design, networking and data storage, security, artificial intelligence, natural language processing, UI design and mobile; the list goes on and is growing every day. As a software engineer, you will work on a specific project critical to Google's needs with opportunities to switch teams and projects as you and our fast-paced business grow and evolve.
Package Engineer Delos DataPackage EngineerPalo Alto, California$180,000–$240,000 / yearSelect and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability. We aim to create an environment where people are treated fairly, supported in their growth, and are empowered to do meaningful work alongside others who take the craft seriously.
Senior Engineer - Automation The Haskell CompanySenior Engineer - AutomationDallas, TexasFull timeAdditionally, you will execute a project from beginning to end, including budget development and estimating, vendor scope development, conducting plant surveys, proposal development, execution of conceptual design work, execution of detailed design, programming, project management and startup. In this role, you will serve as the lead technical resource for all automation scopes of work related to a project and be responsible for coordination of design activities across multiple disciplines, vendors and/or subcontractors.
Senior Engineer - Industrial Automation The Haskell CompanySenior Engineer - Industrial AutomationCharlotte, North CarolinaFull timeAdditionally, you will execute a project from beginning to end, including budget development and estimating, vendor scope development, conducting plant surveys, proposal development, execution of conceptual design work, execution of detailed design, programming, project management and startup. In this role, you will serve as the lead technical resource for all automation scopes of work related to a project and be responsible for coordination of design activities across multiple disciplines, vendors and/or subcontractors.
Packaging & Material Handling System Designer WSP Global IncPackaging & Material Handling System DesignerMeridian, ID$23.85–$34.52 / hourOur Facilities and Industrial Systems teams support clients across food & beverage, consumer products, and advanced manufacturing markets by designing efficient, reliable packaging and material handling systems. This role is ideal for an experienced designer who brings strong technical expertise, leadership capability, and the ability to deliver high-quality packaging system designs from concept through construction.
Senior Packaging & Material Handling Systems Designer WSP Global IncSenior Packaging & Material Handling Systems DesignerPlover, WI$35.15–$51.25 / hourThis role is ideal for an experienced designer who brings strong technical expertise, leadership capability, and the ability to deliver high-quality packaging system designs from concept through construction. WSP USA is providing the compensation range that the company in good faith believes it might pay and offer for this position, based on the successful applicant's education, experience, knowledge, skills, abilities in addition to internal equity and specific geographic location.
Director, IC Packaging Engineering - Mechanical Simulation Qualcomm IncDirector, IC Packaging Engineering - Mechanical SimulationSan Diego, CA$227,300–$340,900 / yearThe Director will drive strategic alignment across IC package design/architecture, New Product Introduction (NPI), assembly, and Chip-Package Interaction (CPI) teams, ensuring high-quality mechanical simulation support across High Volume Manufacturing (HVM) and advanced packaging programs. Core technical responsibilities include overseeing the development and validation of mechanical FEA models (ANSYS APDL), establishing BKM methodology for test correlation and material characterization, and guiding stress/mechanical analysis for IC package designs.
Signal Integrity Engineer - Serdes, Satellites Starlink Space Exploration Technologies CorpSignal Integrity Engineer - Serdes, Satellites StarlinkPalo Alto, CA$115,000–$155,000 / yearWork alongside RF engineers, antenna engineers, ASIC engineers, packaging engineers, mechanical engineers, thermal engineers, software engineers, supply chain, and production engineers (among others) to architect new products which will employ novel channels, interfaces, and power delivery strategies. As a Signal Integrity Engineer on Starlink's Payload Engineering team, you'll have SI ownership throughout the entire life-cycle of the portfolio of hardware that enables this connectivity, and sits at the intersection of electrical, mechanical, thermal analysis, software, and antenna/RF engineering.