Product Design Engineer II Pinnacle Technical ResourcesProduct Design Engineer IICupertino,, California$50–$60 / hourContractorThe specific compensation for this position will be determined by a number of factors, including the scope, complexity and location of the role as well as the cost of labor in the market; the skills, education, training, credentials and experience of the candidate; and other conditions of employment. Client’s approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
Senior IC Packaging Engineer Axiado CorpSenior IC Packaging EngineerSan Jose, CAAxiado has also won numerous industry awards for our ground-breaking products and technological innovations, including being named one of Fast Companys 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliances 2025 Start-Up to Watch award. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management.
Packaging Engineer Manpower EngineeringPackaging EngineerFremont, CATemporaryManpowerGroup® (NYSE: MAN), the leading global workforce solutions company, helps organizations transform in a fast-changing world of work by sourcing, assessing, developing, and managing the talent that enables them to win. We are recognized consistently for our diversity - as a best place to work for Women, Inclusion, Equality and Disability and in 2023 ManpowerGroup was named one of the World's Most Ethical Companies for the 14th year - all confirming our position as the brand of choice for in-demand talent.
Senior Packaging Engineer Zp Group LlcSenior Packaging EngineerSaratoga, CA$210,000–$265,000 / yearKeywords: advanced packaging, flip‑chip, multi‑chip module, MCM, organic substrate, CoWoS, 2.5D, 3D packaging, TSMC system‑on‑wafer, OSAT, Wistron, module integration, cold plate integration, wafer‑level assembly, substrate technology, semiconductor packaging, high‑density interconnect, HDI substrates, yield improvement, semiconductor manufacturing, module engineering. The ideal Senior Packaging Engineer will lead advanced component and system‑level packaging efforts, with a strong emphasis on pcb assembly and organic substrate technologies on site in Saratoga, CA.
Internship, Packaging Engineer, Supply Chain (Fall 2026) Tesla IncInternship, Packaging Engineer, Supply Chain (Fall 2026)Fremont, CA$16.35–$33.65 / hourConsider before submitting an application: This position is expected to start August 2026 or September 2026 and continue through the Fall term (ending approximately December 2026 or later, if available). Demonstrated ability to facilitate dynamic cross-functional projects with engineering, supply chain, manufacturing and test to meet project timelines.
NewStaff IC Packaging Engineer - Advanced Packages & Power Analog DevicesStaff IC Packaging Engineer - Advanced Packages & PowerSan Jose, CAAnalog Devices, Inc. is searching for a highly motivated Staff Semi Packaging Engineer based in San Jose, CA. The position focuses on advanced IC package platforms, project management, and collaboration with cross-functional teams.
Advanced Packaging Engineer DensityAIAdvanced Packaging EngineerMountain View, CA$200,000–$350,000 / year10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies. Demonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions.
Photonic Packaging Engineer, Principal Astera Labs IncPhotonic Packaging Engineer, PrincipalSan Jose, CAAstera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
Packaging Engineer Nexthop Systems IncPackaging EngineerSanta Clara, CAQualification plans to characterize and validate packaging solutions for product and it's FRU (Field replaceable unit), subassemblies or components as per industry or internal specifications by working closely with HW design (mechanical, thermal, electrical etc.) Come out with innovative ideas for cost optimization, durability during shipping, environmental impact, and compliance with safety regulations. In this role, you'll combine technical expertise with innovative problem-solving to plan & execute all qualifications activities for cutting-edge packaging designs, ensuring they meet the stringent demands of all global shipping environments.
Memory Packaging Engineer Apple IncMemory Packaging EngineerSanta Clara, CAMinimum requirement of a bachelors degree in a relevant fieldMS or PhD preferred, with 3+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages. If you are driven to solve the industrys toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.
Packaging Engineer Analog Devices IncPackaging EngineerSan Jose, CA$86,480–$118,910 / yearADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
Staff Semi Packaging Engineer Analog DevicesStaff Semi Packaging EngineerSan Jose, CaliforniaADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
NewPackaging Engineer: IC & Power Module Design Analog DevicesPackaging Engineer: IC & Power Module DesignSan Jose, CA$86,480–$118,910 / yearA Bachelor's degree in Materials Science, Electrical Engineering, or related fields is required, along with knowledge in IC design, data analysis, and programming in Python. Analog Devices, Inc. seeks a Packaging Engineer in San Jose, CA, to design and optimize IC packages for diverse products.
Sr Packaging Engineer Applied Materials IncSr Packaging EngineerSanta Clara, CA$133,500–$183,500 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
NewSenior IC Packaging Engineer - NPI & HVM Leadership Broadcom CorporationSenior IC Packaging Engineer - NPI & HVM LeadershipSan Jose, CAWith a strong educational background in engineering and extensive hands-on experience in advanced IC packaging, you will manage packaging deliverables, ensuring optimal design and execution throughout the lifecycle.#J-18808-Ljbffr. You'll collaborate closely with chip design, system design, and manufacturing teams to deliver industry-leading package solutions.
Principal Packaging Engineer Skyworks Solutions IncPrincipal Packaging EngineerSan Jose, CAAt Skyworks you will find a fast-paced environment with a strong focus on global collaboration minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creative thinking. Experience in package design and proficient in Cadence Allegro platform tools, PCB Editor, Advanced Package Designer, APDSiP, or Mentor Xpedition platform tools.
Advanced Packaging Process Engineer Tenstorrent IncAdvanced Packaging Process EngineerSanta Clara, CAPartner with design, reliability, and architecture teams to evaluate tradeoffs (bump pitch, stack-ups, embedded Si, etc.) and lead test vehicle planning to meet program needs. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.
NewSenior Substrate & 3DIC Packaging Engineer TSMC - Taiwan Semiconductor Manufacturing Company LimitedSenior Substrate & 3DIC Packaging EngineerSan Jose, CAA leading semiconductor foundry in San Jose seeks a highly skilled Substrate / Advanced Package Engineer to innovate in 3DIC design and packaging. Responsibilities include designing, simulating, and optimizing advanced packaging technologies while collaborating with cross-functional teams.
Sr. Industrial Designer (Packaging) SanDisk CorpSr. Industrial Designer (Packaging)Milpitas, CAAn employee's pay position within the salary range may be based on several factors including but not limited to (1) relevant education; qualifications; certifications; and experience; (2) skills, ability, knowledge of the job; (3) performance, contribution and results; (4) geographic location; (5) shift; (6) internal and external equity; and (7) business and organizational needs. Sandisk is looking for a Senior Packaging Industrial Designer to join global industrial design team to design 3D structural packaging solutions for world‑class consumer storage products.
Silicon Photonics & Optical Packaging Engineer Apple IncSilicon Photonics & Optical Packaging EngineerCAIn this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM.
NewMechanical Packaging Engineer Co-op NokiaMechanical Packaging Engineer Co-opSunnyvale, CAD. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US.RESPONSIBILITIESPerform mechanical integrity and thermal simulations, tolerance analyses and characterization. Solid interpersonal, communication and problem‑solving skills in order to interact with engineering staff, external vendors and contractors effectively.
Integrated Circuit - Packaging Architect Engineer Advanced Micro Devices, IncIntegrated Circuit - Packaging Architect EngineerSan Jose, CaliforniaSuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. Responsibilities: The Role : Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
Senior Engineer, Semi Packaging Engineering Analog Devices IncSenior Engineer, Semi Packaging EngineeringSan Jose, CA$132,142–$164,910 / yearRequirements: Must have a Masters degree in Mechanical Engineering, Materials Science, Electrical Engineering, Autonomy and Robotics Engineering, or related field (willing to accept a foreign education equivalent) and two (2) years of experience as a Packaging Engineer or related occupation conceptualizing and productizing semiconductor devices to bridge analog signals to digital Cloud. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
Associate Optical Packaging Engineer PsiQuantum CorpAssociate Optical Packaging EngineerMilpitas, CA$85,000–$120,000 / yearOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate''s qualifications including relevant education and training, competencies, experience, geographic location, and business needs.
Software Engineer 5 - Ads Pricing & Packaging Netflix IncSoftware Engineer 5 - Ads Pricing & PackagingLos Gatos, CA$388,000–$619,000 / yearThe Ads Pricing and Packaging team is responsible for developing cutting-edge inventory management systems which support various monetization strategies, including dynamic pricing, rate card management, product packaging, inventory segmentation, and yield optimization. Skills & experience we're seeking: Professional experience in building inventory management solutions that support monetization strategies such as dynamic pricing, rate card management, product packaging, inventory split and yield management.
Senior Packaging Design Engineer, Silicon Google LLCSenior Packaging Design Engineer, SiliconMountain View, CA$163,000–$237,000 / yearCollaborate closely with Signal Integrity (SI), Power Integrity (PI), Test, New Product Introduction (NPI), and Mechanical Engineering teams to refine and optimize product package architecture and design. Skip navigation links home Home work_outline Jobs noogler_hat Students google How we work handyman How we hire person_outline Your career help_outline Help.
Advanced Packaging Engineer - SI/PI Marvell Technology IncAdvanced Packaging Engineer - SI/PISanta Clara, CA$97,630–$146,300 / yearHighlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. Expected Base Pay Range (USD) $97,630 - $146,300 per annum The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions.
Foundry Services Advanced Packaging Account Technical Solutions Engineer Intel CorpFoundry Services Advanced Packaging Account Technical Solutions EngineerSanta Clara, CA$220,320–$311,040 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
NewSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and Integration Macpower Digital Assets Edge Private LimitedSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and IntegrationSanta Clara, CA$64 / hourIf you enjoy solving complex challenges in mixed-signal design, chiplet integration, and high-performance electronics , this role is for you. We are looking for a Senior Electrical Engineer with deep expertise in semiconductor design, advanced packaging, and ASIC development .
Packaging Assembly Engineer Apple IncPackaging Assembly EngineerCupertino, CAIn this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC. Define and optimize end-to-end FCBGA assembly process flow (wafer back-end interface, flip-chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).
Sr. Principal Engineer, Advanced Packaging Marvell Technology IncSr. Principal Engineer, Advanced PackagingSanta Clara, CAThe group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Technologist, Packaging Engineering SanDisk CorpTechnologist, Packaging EngineeringMilpitas, CAProvide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), influencing product architecture and manufacturing strategy at the system level. ESSENTIAL DUTIES AND RESPONSIBILITIES: Serve as the senior Package Engineering representative on cross‑functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements.
Principal Packaging Engineer Delos DataPrincipal Packaging EngineerPalo Alto, CaliforniaSelect and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability. We aim to create an environment where people are treated fairly, supported in their growth, and are empowered to do meaningful work alongside others who take the craft seriously.
Co-Packaged Optics Packaging Process Development Engineer Marvell Technology IncCo-Packaged Optics Packaging Process Development EngineerSanta Clara, CAWork with cross-functional packaging teams and lead process development at foundry along with 2.5D/3D CoW process development with particular emphasis on chemistry development with packaging consumable suppliers at OSATs to bring packaging solutions from concept to prototypes and ramp to high volume manufacturing with aggressive cost reduction strategies. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Packaging Product Design Engineer Apple IncPackaging Product Design EngineerCupertino, CACollaborate with cross-functional teams including industrial design, hardware, environmental, operations, and technology groups to refine and execute on the design on the packaging. Apple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
NewSenior Signal Integrity Engineer - LPU Packaging NVIDIA GruppeSenior Signal Integrity Engineer - LPU PackagingSanta Clara, CA$168,000–$264,500 / yearWhat we need to see BS, MS, or PhD in Electrical Engineering or equivalent experience.8+ years of industry experience in signal integrity, high-speed interconnect design, or related hardware development roles. Develop and execute simulation flows for advanced packaging technologies, including 2.5D, 3D, and multi-die integration, focusing on channel loss, discontinuities, return path behavior, and crosstalk.
NewSenior Signal Integrity Engineer - 2.5D/3D Packaging Lead NVIDIA GruppeSenior Signal Integrity Engineer - 2.5D/3D Packaging LeadSanta Clara, CA$168,000–$264,500 / yearNVIDIA Gruppe is seeking a Senior Signal Integrity Engineer for its Packaging and Systems team in Santa Clara, California. The ideal candidate will lead high-speed SerDes channel design and signal integrity analysis.
Semiconductor Packaging Modeling and Simulation Engineer onsemiSemiconductor Packaging Modeling and Simulation EngineerSan Jose, CAWith a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.
Sr. Packaging Engineer NEXTracker IncSr. Packaging EngineerFremont, CA$160,000–$175,000 / yearThis role goes beyond traditional packaging design, focusing on end-to-end packaging systems, including returnable packaging, reverse logistics, cost modeling, and network-wide performance. Our talented worldwide teams are redefining how solar power plants are designed, built, and operated every day with smart technology, data-driven insights, and advanced automation.
Advanced Packaging Technologist Google LLCAdvanced Packaging TechnologistSunnyvale, CAFrom software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. As an advanced packaging technologist, you will develop advanced packaging solutions (2.5D/3D/3.5D) for ML chips, which involves collaborating with architects, Signal Integrity (SI)/Power Integrity (PI), thermal, and Printed Circuit Board (PCB) engineers to create high-performance packages optimized for electrical performance, reliability, and assembly.
Memory Packaging Engineer MediaTek IncMemory Packaging EngineerSan Jose, CACollaborate closely with IP, ASIC design, package design, Signal Integrity (SI), Power Integrity (PI), Thermal and modeling technologies, Product Engineering, and Test Engineering teams to enable innovative solutions. Roles and Responsibilities: Supports MediaTek's Memory packaging technology development including but not limited to HBM package, cHBM, LPDDR package for mobile applications, In Package Memory (IPM) for Edge AI, etc.
NewSenior Reliability Engineer - LPU Packaging NvidiaSenior Reliability Engineer - LPU PackagingSanta Clara, CACome join the team and see how you can make a lasting impact on the world!## **What you'll be doing:*** Own the package‑level reliability spec for assigned products* Define qualification requirements and pass/fail criteria for device/package‑level reliability (e.g., HTSL, TCT, UHAST, pre‑conditioning, JESD22 methods) and Package‑on‑board / board‑level reliability (thermal cycling, shock/vibration, connector/cage interactions)* Leads materials and stackup selection (substrate, solder alloy, underfill, mold, lid, TIM, etc.) and DFR trade‑offs for new packages and 2nd sources* Evaluates thermo‑mechanical and SI/PI impact of those choices* Analyzes qual and stress data (including HTOL, package qual, SLT/system stress) and convert to design / process/ material changes for next revision.* Senior Reliability Engineer - LPU Packaging page is loaded## Senior Reliability Engineer - LPU Packaginglocations: US, CA, Santa Claratime type: Full timeposted on: Posted Todayjob requisition id: JR2013787NVIDIA is looking for a Senior Reliability Engineer to join our LPU packaging team.
Packaging Product Design Engineering Manager Apple IncPackaging Product Design Engineering ManagerCupertino, CAApple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials. As a Packaging PD Manager, you will lead a team of engineers to design and execute packaging architecture from initial prototypes to mass production with sustainable packaging material.
Laser Principal Packaging Engineer - Optical Solutions R&D MolexLaser Principal Packaging Engineer - Optical Solutions R&DFremont, CAFull timeOur advanced optical, mechanical, electrical, and software design capabilities support the evolving needs of high-density, high-bandwidth, and flexible optical networks across telecom, datacom, hyperscale datacenters, artificial intelligence, and supercomputing. The position requires close collaboration with R&D and product design teams, manufacturing, suppliers, and customers to ensure laser components meet stringent optical, mechanical, and Telcordia reliability requirements.
Cloud Hardware Development, Packaging, Network Product Development - Optics Amazon.com IncCloud Hardware Development, Packaging, Network Product Development - OpticsCupertino, CAYou will perform high-quality design, development, validation, and sustaining engineering of IC and SOC packages for high-speed applications, working closely with design teams, manufacturing partners, and cross-functional stakeholders to deliver robust solutions at scale. Within AWS Networking the NPD (Network Product Development) organization is responsible for, designing the hardware, building the software, and owning the interconnects for the routers that power the global AWS network.
NewPackaging Process Development Engineer AmphenolPackaging Process Development EngineerFremont, CACreate and execute DOE (design of experiments) to optimize process windows and yield; analyze results using statistical tools (e.g., Minitab/JMP).Author and maintain process documentation: process sheets, work instructions, SPC/CPK reports, FMEA, PPAP/APQP packages (for automotive customers).Partner with suppliers and contract manufacturers to qualify equipment, processes, materials (epoxies, solders, plating chemistries), and subcontractor processes; perform supplier audits as needed. Technical tools & equipment (examples)Software: Minitab/JMP, Excel, Word, PowerpointLab/process tools: wire bonders, flip‑chip bonders, die bonders, reflow ovens, mold presses, plasma cleaning tools,, pick‑and‑place, X‑ray/CT, SEM, C‑SAM, environmental chambers for thermal/humidity testing.
Senior Optical Packaging Process Engineer PsiQuantum CorpSenior Optical Packaging Process EngineerPalo Alto, CA$160,000–$180,000 / yearOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate's qualifications including relevant education and training, competencies, experience, geographic location, and business needs.
NewSenior Mechanical Engineer - UHV System Packaging KLASenior Mechanical Engineer - UHV System PackagingMilpitas, CAThis role requires a Bachelor's degree in Mechanical Engineering and 5+ years of experience with a high emphasis on innovative designs in UHV environments. The ideal candidate will focus on system-level packaging and facility integration while working cross-functionally to deliver robust and manufacturable solutions.
NewEvening Packaging Test Engineer (Swing Shift) Ryzen SolutionsEvening Packaging Test Engineer (Swing Shift)San Jose, CAThis hands-on role involves analyzing data and ensuring project accuracy and quality through effective communication and documentation. The ideal candidate will hold a B.S. degree in a relevant field and have 2-5 years of laboratory experience.
Lab Packaging Test Engineer I Engineer In Training (Swing Shift) Ryzen SolutionsLab Packaging Test Engineer I Engineer In Training (Swing Shift)San Jose, CA$66,560Perform testing duties within the designated workday hours according to requirements to ensure customer objectives are met through proactive communication, documentation, and customer service. Maintain responsive customer communication in email and in person regarding testing services provided, test status, updates, and results.