Product Design Engineer II Pinnacle Technical ResourcesProduct Design Engineer IICupertino,, California$50–$60 / hourContractorThe specific compensation for this position will be determined by a number of factors, including the scope, complexity and location of the role as well as the cost of labor in the market; the skills, education, training, credentials and experience of the candidate; and other conditions of employment. Client’s approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
Packaging Engineer The Fountain Group LLCPackaging EngineerFoster City, CA$88.89–$96.30 / hourWe are seeking an experienced Cold Chain Packaging Engineer to develop, test, qualify, and support temperature-controlled (cold chain) packaging systems for the safe distribution of pharmaceutical and biologic products worldwide. What We're Looking For: Bachelor's degree in Packaging Engineering, Mechanical Engineering, Industrial Engineering, Biomedical Engineering, Chemical Engineering, or a related scientific field.
Senior IC Packaging Engineer Axiado CorpSenior IC Packaging EngineerSan Jose, CAAxiado has also won numerous industry awards for our ground-breaking products and technological innovations, including being named one of Fast Companys 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliances 2025 Start-Up to Watch award. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management.
NewPackaging Engineer Intellectt INCPackaging EngineerFremont, CAThe role involves collaborating with cross-functional teams to develop innovative packaging solutions that optimize product protection, manufacturability, and logistics efficiency. This position requires a continuous improvement mindset, strong communication skills, and the ability to deliver high-quality solutions while supporting sustainability initiatives.
Photonic Packaging Engineer, Principal Astera Labs IncPhotonic Packaging Engineer, PrincipalSan Jose, CA$205,000–$255,000 / yearAstera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
Packaging Engineer Manpower EngineeringPackaging EngineerFremont, CATemporaryManpowerGroup® (NYSE: MAN), the leading global workforce solutions company, helps organizations transform in a fast-changing world of work by sourcing, assessing, developing, and managing the talent that enables them to win. We are recognized consistently for our diversity - as a best place to work for Women, Inclusion, Equality and Disability and in 2023 ManpowerGroup was named one of the World's Most Ethical Companies for the 14th year - all confirming our position as the brand of choice for in-demand talent.
NewSenior IC Packaging Engineer AvicenaTechSenior IC Packaging EngineerSunnyvale, CaliforniaTroubleshoot excursions using FA data, cross-sections, and metrology (CD-SEM, profilometry, XRF, AOI) to root-cause defects such as TSV protrusion variation, via reveal non-uniformity, bump voiding, or co-planarity issues. Lead development, characterization, and optimization of TSV (Through-Silicon Via) reveal processes, including back grind, CMP, dielectric/barrier reveal etch, and thickness/uniformity control across wafer thinning stacks.
Senior Packaging Engineer Zp Group LlcSenior Packaging EngineerSaratoga, CA$210,000–$265,000 / yearKeywords: advanced packaging, flip‑chip, multi‑chip module, MCM, organic substrate, CoWoS, 2.5D, 3D packaging, TSMC system‑on‑wafer, OSAT, Wistron, module integration, cold plate integration, wafer‑level assembly, substrate technology, semiconductor packaging, high‑density interconnect, HDI substrates, yield improvement, semiconductor manufacturing, module engineering. The ideal Senior Packaging Engineer will lead advanced component and system‑level packaging efforts, with a strong emphasis on pcb assembly and organic substrate technologies on site in Saratoga, CA.
Internship, Packaging Engineer, Supply Chain (Fall 2026) Tesla IncInternship, Packaging Engineer, Supply Chain (Fall 2026)Fremont, CA$16.35–$33.65 / hourConsider before submitting an application: This position is expected to start August 2026 or September 2026 and continue through the Fall term (ending approximately December 2026 or later, if available). Demonstrated ability to facilitate dynamic cross-functional projects with engineering, supply chain, manufacturing and test to meet project timelines.
Memory Packaging Engineer Apple IncMemory Packaging EngineerSanta Clara, CAMinimum requirement of a bachelors degree in a relevant fieldMS or PhD preferred, with 3+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages. If you are driven to solve the industrys toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.
Packaging Engineer Nexthop Systems IncPackaging EngineerSanta Clara, CAQualification plans to characterize and validate packaging solutions for product and it's FRU (Field replaceable unit), subassemblies or components as per industry or internal specifications by working closely with HW design (mechanical, thermal, electrical etc.) Come out with innovative ideas for cost optimization, durability during shipping, environmental impact, and compliance with safety regulations. In this role, you'll combine technical expertise with innovative problem-solving to plan & execute all qualifications activities for cutting-edge packaging designs, ensuring they meet the stringent demands of all global shipping environments.
Sr Packaging Engineer Applied Materials IncSr Packaging EngineerSanta Clara, CA$133,500–$183,500 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
NewSr. Technical Program Manager, Packaging Tesla IncSr. Technical Program Manager, PackagingFremont, CA$112,000–$217,200 / yearFremont s packaging engineering team is seeking a Packaging Technical Program Manager to lead the scheduling, risk management, and status communication for innovative packaging programs, collaborating closely with packaging engineers to develop and implement cutting-edge solutions. In this role, you will partner with a broad cross-functional team-including supply chain, design, planning, manufacturing, and material flow stakeholders-to identify, prioritize, and execute packaging projects that support production ramp-up and drive overall cost reductions.
Advanced Packaging Engineer DensityAIAdvanced Packaging EngineerMountain View, CA$200,000–$350,000 / year10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies. Demonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions.
NewPackaging Engineer - I TekWissen LLCPackaging Engineer - IFoster City, CA$84–$90Work Type: Onsite Job Description: This position resides within the Packaging Development team at Client, with a primary focus on the development, qualification, and lifecycle management of controlled temperature (cold chain) packaging systems (thermal protection systems) to ensure product quality and regulatory compliance across global distribution of our pharmaceuticals and biologics products. Specific Education and Experience: B.S. degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering, or a related scientific field.
Cold Chain Packaging Engineer Net2SourceCold Chain Packaging EngineerFoster City, CA$88.89–$96.30 / hourThis position resides within the Packaging Development team with a primary focus on the development, qualification, and lifecycle management of controlled temperature (cold chain) packaging systems (thermal protection systems) to ensure product quality and regulatory compliance across global distribution of our pharmaceuticals and biologics products. Specific Education and Experience B.S. degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering , or a related scientific field.
Silicon Photonics & Optical Packaging Engineer Apple IncSilicon Photonics & Optical Packaging EngineerCAIn this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM.
NewSenior IC Packaging Engineer Microsoft CorpSenior IC Packaging EngineerMountain View, CA$119,800–$234,700 / yearPreferred Qualifications: Doctorate in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 3+ years technical engineering experience OR Masters Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 8+ years technical engineering experience OR equivalent experience. Required Qualifications: Doctorate in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 1+ year(s) technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 4+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 5+ years technical engineering experience OR equivalent experience.
NewLead Engineer - Advanced IC Packaging TeraDARLead Engineer - Advanced IC PackagingSan Jose, CADrive material selection, DFM, and reliability qualification to meet automotive‑grade requirements (AEC‑Q).Maintain and leverage relationships with OSATs, substrate suppliers, and ecosystem partners to accelerate development. This is a high‑impact role that combines technical leadership, hands‑on thermo‑mechanical and physical design, and vendor management to bring cutting‑edge multi‑chip packages into production.
Principal Packaging Engineer Skyworks Solutions IncPrincipal Packaging EngineerSan Jose, CAAt Skyworks you will find a fast-paced environment with a strong focus on global collaboration minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creative thinking. Experience in package design and proficient in Cadence Allegro platform tools, PCB Editor, Advanced Package Designer, APDSiP, or Mentor Xpedition platform tools.
Advanced Packaging Process Engineer Tenstorrent IncAdvanced Packaging Process EngineerSanta Clara, CAPartner with design, reliability, and architecture teams to evaluate tradeoffs (bump pitch, stack-ups, embedded Si, etc.) and lead test vehicle planning to meet program needs. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.
Staff Semi Packaging Engineer Analog Devices IncStaff Semi Packaging EngineerSan Jose, CA$130,168–$188,490 / yearADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
NewPackaging Engineer Analog DevicesPackaging EngineerSan Jose, CA$86,480–$118,910 / yearJob Req Type: Graduate JobRequired Travel: Yes, 10% of the timeThe expected wage range for a new hire into this position is $86,480 to $118,910.Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers.
NewPackaging Engineer: IC & Power Module Design Analog DevicesPackaging Engineer: IC & Power Module DesignSan Jose, CAAnalog Devices in San Jose, CA, is seeking a motivated Packaging Engineer to drive development for IC packages and modules. The ideal candidate holds a bachelor's degree in relevant fields and has experience in package design and manufacturing.
NewSenior Packaging Engineer, NPI & Cross-Functional Lead Analog DevicesSenior Packaging Engineer, NPI & Cross-Functional LeadSan Jose, CAThe ideal candidate will have a Master's degree in Mechanical Engineering or a related field, with 3-4 years of experience in the semiconductor packaging industry. Analog Devices is seeking a highly motivated Senior Packaging Engineer to advance package development within the New Product Introduction (NPI) pipeline.
NewPrincipal RF SiP Packaging Engineer: Lead Innovation Skyworks SolutionsPrincipal RF SiP Packaging Engineer: Lead InnovationSan Jose, CAA leader in analog semiconductors is seeking a Principal Packaging Engineer in San Jose, CA, to support new product development of RF System in Package (SiP) modules. The role involves defining package requirements, owning product development from feasibility to production, and leading strategic packaging initiatives.
NewStaff Packaging Engineer: 2.5D/3D Hybrid AdeiaStaff Packaging Engineer: 2.5D/3D HybridSan Jose, CA$150,000–$195,000 / yearThe ideal candidate should have a Master's degree and over 7 years of experience in semiconductor packaging, along with hands-on experience with assembly processes and engineering builds. This role involves developing and optimizing semiconductor packaging solutions, focusing on reliability, integration, and advanced technologies.
Integrated Circuit - Packaging Architect Engineer Advanced Micro Devices, IncIntegrated Circuit - Packaging Architect EngineerSan Jose, CaliforniaSuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. Responsibilities: The Role : Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
Packaging Engineer - I* MindlancePackaging Engineer - I*Foster city, CA$92–$96.29 / hourB.S. degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering, or a related scientific field. · Author packaging protocols, reports, and technical documentation to support shipping qualification and regulatory filings.
Senior Fiber Optic Module Packaging Engineer II-VI Optical Systems, Inc.Senior Fiber Optic Module Packaging EngineerSunnyvale, CAWe are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard-work through a competitive compensation program.
Associate Optical Packaging Engineer PsiQuantum CorpAssociate Optical Packaging EngineerMilpitas, CA$85,000–$120,000 / yearOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate''s qualifications including relevant education and training, competencies, experience, geographic location, and business needs.
Senior Fiber Optic Module Packaging Engineer Coherent CorpSenior Fiber Optic Module Packaging EngineerSunnyvale, CAWe are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard-work through a competitive compensation program.
Sr. Industrial Designer (Packaging) SanDisk CorpSr. Industrial Designer (Packaging)Milpitas, CAAn employee's pay position within the salary range may be based on several factors including but not limited to (1) relevant education; qualifications; certifications; and experience; (2) skills, ability, knowledge of the job; (3) performance, contribution and results; (4) geographic location; (5) shift; (6) internal and external equity; and (7) business and organizational needs. Sandisk is looking for a Senior Packaging Industrial Designer to join global industrial design team to design 3D structural packaging solutions for world‑class consumer storage products.
NewMechanical Subsystem Design Engineer (Electronics packaging) - # 26-17111 US Tech Solutions, Inc.Mechanical Subsystem Design Engineer (Electronics packaging) - # 26-17111Milpitas, CA$65–$69 / hourCandidates with strong experience in electronics packaging, mechanical platform design, and mechanical integration involving pneumatics, vacuum systems, cooling systems, water cooling, or fluid/piping distribution will be highly valued. The ideal candidate has experience designing integrated electromechanical systems—not solely manufacturing tooling or fixture design—and has successfully owned mechanical designs from concept through production release.
Software Engineer 5 - Ads Pricing & Packaging Netflix IncSoftware Engineer 5 - Ads Pricing & PackagingLos Gatos, CA$388,000–$619,000 / yearThe Ads Pricing and Packaging team is responsible for developing cutting-edge inventory management systems which support various monetization strategies, including dynamic pricing, rate card management, product packaging, inventory segmentation, and yield optimization. Skills & experience we're seeking: Professional experience in building inventory management solutions that support monetization strategies such as dynamic pricing, rate card management, product packaging, inventory split and yield management.
NewSenior Packaging Engineer: Graphene & Thermal Integration Destination 2DSenior Packaging Engineer: Graphene & Thermal IntegrationSan Jose, CAThis role involves architecting advanced solutions, optimizing thermal management, and collaborating with engineering teams to drive technological advancements in high-performance computing. A leading technology firm in San Jose is seeking a Senior Packaging Engineer to design innovative packaging solutions leveraging advanced materials like graphene.
NewPrincipal Packaging Engineer Velaura AI IncPrincipal Packaging EngineerSan Jose, CA$200,000–$500,000 / yearCompensation for this role includes a competitive base salary, performance-based incentives, and equity participation, allowing team members to share in the company's long-term success. Own package-level signal integrity and power integrity planning for high-speed interfaces including LPDDR, PCIe, Ethernet, and other high-speed I/O.
Packaging Assembly Engineer Apple IncPackaging Assembly EngineerCupertino, CAIn this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC. Define and optimize end-to-end FCBGA assembly process flow (wafer back-end interface, flip-chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).
Sr. Principal Engineer, Advanced Packaging Marvell Technology IncSr. Principal Engineer, Advanced PackagingSanta Clara, CAThe group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
NewSenior IC Packaging Development Engineer NVIDIA CorpSenior IC Packaging Development EngineerSanta Clara, CAWith competitive salaries and a generous benefits package, we are widely considered to be one of the technology world's most desirable employers; we have some of the most forward-thinking and hardworking people in the world working for us and, due to unparalleled growth, best-in-class teams are rapidly growing. This will include planning & driving related R&D with multiple internal and external partners and you will be responsible for establishing advanced packaging processes needed to meet our NPI goals regarding packaging turn-around-time, reliability, and chip-package interaction.
NewOptical Packaging/Component Engineer AvicenaTechOptical Packaging/Component EngineerSunnyvale, CaliforniaDesign multi-fiber optical connectors and work with external vendors to develop connector eco-system. Work with optical fibers, optical launch optimization and optical loss testing.
NewPackaging Engineer LancesoftPackaging EngineerFoster City, CA$70–$96.30 / hourThis position resides within the Packaging Development team, with a primary focus on the development, qualification, and lifecycle management of controlled temperature (cold chain) packaging systems (thermal protection systems) to ensure product quality and regulatory compliance across global distribution of our pharmaceuticals and biologics products. Degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering, or a related scientific field.
Senior Packaging Design Engineer, Silicon Google LLCSenior Packaging Design Engineer, SiliconMountain View, CA$163,000–$237,000 / yearCollaborate closely with Signal Integrity (SI), Power Integrity (PI), Test, New Product Introduction (NPI), and Mechanical Engineering teams to refine and optimize product package architecture and design. Skip navigation links home Home work_outline Jobs noogler_hat Students google How we work handyman How we hire person_outline Your career help_outline Help.
Co-Packaged Optics Packaging Process Development Engineer Marvell Technology IncCo-Packaged Optics Packaging Process Development EngineerSanta Clara, CAWork with cross-functional packaging teams and lead process development at foundry along with 2.5D/3D CoW process development with particular emphasis on chemistry development with packaging consumable suppliers at OSATs to bring packaging solutions from concept to prototypes and ramp to high volume manufacturing with aggressive cost reduction strategies. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Packaging Product Design Engineer Apple IncPackaging Product Design EngineerCupertino, CAThe Packaging PD team is a diverse group of people responsible for the design and execution of structural packaging for all Apple products - from shippers to finished goods boxes. Apple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
NewSenior Advanced Packaging Engineer 2.5D/3D & Equity RenesasSenior Advanced Packaging Engineer 2.5D/3D & EquitySan Jose, CARenesas Electronics in San Jose, California is seeking a Senior Advanced Packaging Engineer to spearhead the development of next-generation packaging solutions for high-performance semiconductors. This position offers an annual salary of $200,000, competitive benefits, and the chance to collaborate with cross-functional teams to ensure top-quality packaging solutions.
Principal Packaging Engineer Delos DataPrincipal Packaging EngineerPalo Alto, CaliforniaSelect and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability. We aim to create an environment where people are treated fairly, supported in their growth, and are empowered to do meaningful work alongside others who take the craft seriously.
NewSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and Integration Macpower Digital Assets Edge Private LimitedSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and IntegrationSanta Clara, CA$64 / hourIf you enjoy solving complex challenges in mixed-signal design, chiplet integration, and high-performance electronics , this role is for you. We are looking for a Senior Electrical Engineer with deep expertise in semiconductor design, advanced packaging, and ASIC development .
Sr. Packaging Engineer NEXTracker IncSr. Packaging EngineerFremont, CA$160,000–$175,000 / yearThis role goes beyond traditional packaging design, focusing on end-to-end packaging systems, including returnable packaging, reverse logistics, cost modeling, and network-wide performance. Our talented worldwide teams are redefining how solar power plants are designed, built, and operated every day with smart technology, data-driven insights, and advanced automation.
Memory Packaging Engineer MediaTek IncMemory Packaging EngineerSan Jose, CACollaborate closely with IP, ASIC design, package design, Signal Integrity (SI), Power Integrity (PI), Thermal and modeling technologies, Product Engineering, and Test Engineering teams to enable innovative solutions. Roles and Responsibilities: Supports MediaTek's Memory packaging technology development including but not limited to HBM package, cHBM, LPDDR package for mobile applications, In Package Memory (IPM) for Edge AI, etc.