Kforce Inc.Senior Packaging Engineer (Microelectronics) Kforce Inc.Senior Packaging Engineer (Microelectronics)Tempe, AZ$180,000–$220,000In this role, you would lead all aspects of microelectronics packaging development, working closely with RFIC, MMIC, and module design teams to create advanced packaging solutions for devices ranging from ICs and System-in-Package (SiP) designs to complex modules and sub-assemblies. Summary: This position would place you as the key Microelectronics Packaging Engineer on a talented space electronics engineering team, responsible for developing next-generation packaging solutions for advanced RF communications products supporting cutting-edge space systems.
Viasat, Inc.RF/Microelectronics Packaging Engineer Viasat, Inc.RF/Microelectronics Packaging EngineerTempe, Arizona$155,500–$246,000 / yearThe packaging development process includes package definition, stack-up, substrate layout, bond diagram, drawings, predictive modeling combined with system testing, technical risk/cost assessment, materials and process characterization, compilation of formal documentation, collaborating with sub-contractors and internal assembly and reliability resources, and final release of product. For specific work locations within San Jose, the San Francisco Bay area and New York City metropolitan area, the base pay range for this role is $193,500.00- $290,500.00/ annually : At Viasat, we consider many factors when it comes to compensation, including the scope of the position as well as your background and experience.
Marvell Technology IncAdvanced Packaging SI/PI Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 3+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 2+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
Marvell Technology IncAdvanced Packaging SI/PI Senior Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Senior Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 3+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
Bright Innovation LabsR&D Packaging Specialist Bright Innovation LabsR&D Packaging SpecialistCoolidge, AZTravel as needed to ensure successful launch and continued execution of projects, including attending line trials, validating packaging suppliers, and troubleshooting quality concerns as they arise. This position offers the opportunity to join a dynamic, fast-paced environment where you will develop strategies to grow market share, enhance brand reputation, improve customer experience, and drive business growth.
Gummi WorldPackaging Associate Gummi WorldPackaging AssociateChandler, AZWe’re currently hiring Packaging Line Operators and Team Members who are excited to grow with us, thrive in a collaborative environment, and take pride in producing products that make a difference in people’s lives. Set up, operate, and monitor packaging machinery (bottle fillers, cappers, labelers, sealers, pouch fillers, etc.).
Veritiv CorpPackaging Design Technology Specialist Veritiv CorpPackaging Design Technology SpecialistChandler, AZCollaborate with cross-functional partners to build, deploy, and maintain machine learning and AI solutions to automate complex packaging design processes, streamline operations, gain business insights, and innovate across services. Job Purpose: Our IT Business Analyst will be responsible for analyzing science, engineering, business, and other data processing problems to implement and improve computer systems.
PPS-HPSMaterial Handler I PPS-HPSMaterial Handler IPhoenix, AZPPS is seeking a Material Handler I for our semiconductor industry facility in Chandler. Ability to exerting up to 45 pounds of force occasionally, and/or up-to 25 pounds of force frequently, and/or up to 15 pounds of force constantly to move objects.
FujifilmWarehouse Technician FujifilmWarehouse TechnicianMesa, ArizonaWith state-of-the-art manufacturing facilities in the U.S., Europe, Taiwan, China, Korea and Japan, local sales offices throughout the world and on-site applications support, FUJIFILM Electronic Materials supplies the world's top tier semiconductor manufacturers with a broad array of products and services used throughout the semiconductor manufacturing process. We have six U.S. manufacturing and Research & Development facilities, located in: Mesa, Arizona; Castroville, California; Hollister, California; Carrollton, Texas; and North Kingstown, Rhode Island—each offering unique local experiences, from vibrant cultural scenes to historic charm.