Senior Packaging Engineer (Microelectronics) Kforce Inc.Senior Packaging Engineer (Microelectronics)Tempe, AZ$180,000–$220,000In this role, you would lead all aspects of microelectronics packaging development, working closely with RFIC, MMIC, and module design teams to create advanced packaging solutions for devices ranging from ICs and System-in-Package (SiP) designs to complex modules and sub-assemblies. Summary: This position would place you as the key Microelectronics Packaging Engineer on a talented space electronics engineering team, responsible for developing next-generation packaging solutions for advanced RF communications products supporting cutting-edge space systems.
RF/Microelectronics Packaging Engineer Viasat, Inc.RF/Microelectronics Packaging EngineerTempe, Arizona$155,500–$246,000 / yearThe packaging development process includes package definition, stack-up, substrate layout, bond diagram, drawings, predictive modeling combined with system testing, technical risk/cost assessment, materials and process characterization, compilation of formal documentation, collaborating with sub-contractors and internal assembly and reliability resources, and final release of product. For specific work locations within San Jose, the San Francisco Bay area and New York City metropolitan area, the base pay range for this role is $193,500.00- $290,500.00/ annually : At Viasat, we consider many factors when it comes to compensation, including the scope of the position as well as your background and experience.
Assembly Packaging Technical Integrator - Intel Foundry Services MAG IntelAssembly Packaging Technical Integrator - Intel Foundry Services MAGChandler, ArizonaJob Type: Experienced HireShift: Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations: US, Oregon, HillsboroBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Technical knowledge and firsthand experience are critical for effective integration of cross functional efforts including Assembly Process technology, Package assembly Design Technology, design services, statistical model-based analysis and Yield and package reliability analysis.
Packaging Module Development Engineer Intel CorpPackaging Module Development EngineerChandler, AZ$115,110–$219,550 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. The candidate should also exhibit the following behavioral traits and/or skills: Technical problem-solving, strong presentation and communication skills, fast-learning skills and solid expertise in their technical field, willingness to collaborate effectively as a team player across multiple teams.
Packaging Process Engineer – Microdisplay SnapPackaging Process Engineer – MicrodisplayChandler, ArizonaThe Company’s three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles. Develop, qualify, and sustain assembly and packaging recipes, control plans, and SPC systems, driving continuous improvement in CD/overlay, defectivity, yields, and reliability.
Packaging Process Engineer - Microdisplay Snap IncPackaging Process Engineer - MicrodisplayChandler, AZ$142,000–$214,000 / yearThe Company's three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles. Develop, qualify, and sustain assembly and packaging recipes, control plans, and SPC systems, driving continuous improvement in CD/overlay, defectivity, yields, and reliability.
Silicon Packaging Design Engineer Intel CorpSilicon Packaging Design EngineerChandler, AZ$105,650–$200,340 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Mechanical Design Engineer – Semiconductor Packaging IntelMechanical Design Engineer – Semiconductor PackagingChandler, ArizonaJob Type: Experienced HireShift: Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Mechanical Design Engineer - Semiconductor Packaging Intel CorpMechanical Design Engineer - Semiconductor PackagingChandler, AZ$105,650–$149,150 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Packaging Module Equipment Development Engineer Intel CorpPackaging Module Equipment Development EngineerChandler, AZ$133,800–$188,890 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Current and future Metrology Engineers are expected to develop strong technical capabilities in the following areas: Operating, programming, troubleshooting, and optimizing automated inspection equipment, including hands-on interaction with hardware components such as lighting systems, cameras, transducers, robotic systems, and conveyors.
Foundry Services Advanced Packaging Account Technical Solutions Engineer Intel CorpFoundry Services Advanced Packaging Account Technical Solutions EngineerChandler, AZ$220,320–$311,040 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
Senior Staff Engineer, Advanced Packaging Technology Development (TD) Marvell Technology IncSenior Staff Engineer, Advanced Packaging Technology Development (TD)Chandler, AZHighlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. The TD team works at the intersection of design, materials, and manufacturing to translate architectural requirements into manufacturable and scalable package solutions, including 2.5D/3D integration, chiplet-based architectures, co-packaged optics (CPO), and advanced substrates.
Senior Technical Solutions Engineer - Advanced Packaging Intel CorpSenior Technical Solutions Engineer - Advanced PackagingChandler, AZ$160,980–$311,040 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Senior Yield Engineer - Substrate & Advanced Packaging Intel CorpSenior Yield Engineer - Substrate & Advanced PackagingChandler, AZ$133,800–$255,200 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Minimum Qualifications and Experience: Candidate must possess a Masters degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry/Physics or related field and 5+ years of experience.
Advanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift) IntelAdvanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift)Chandler, ArizonaJob Type: Experienced HireShift: Shift 4 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. This role is responsible for supporting lot movement through the manufacturing line, responding to process excursions, recovering from equipment errors, dispositioning lots, enabling new tools, and performing other operational activities required to support factory objectives.
Advanced Packaging SI/PI Senior Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Senior Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 3+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
Advanced Packaging SI/PI Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 3+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 2+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
NewPackaging Module Engineer IntelPackaging Module EngineerChandler, ArizonaJob Type: Experienced HireShift: Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Advanced Packaging Design Marvell Technology IncAdvanced Packaging DesignChandler, AZAs an Advanced Packaging Design engineer, responsibilities include understanding of substrate or PCB design tools such as APD or Xpedition to generate advanced packaging solutions, along with knowledge of floor-planning and architectural considerations surrounding the routing of various interfaces through package substrates and interposers. The ideal candidate will possess a bachelor's degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or master's degree and/or PhD in Electrical Engineering with 3+ years of professional experience.
ADCE Packaging Design Architect IntelADCE Packaging Design ArchitectChandler, ArizonaJob Type: Experienced HireShift: Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations: US, California, Folsom, US, California, Santa Clara, US, Colorado, Fort Collins, US, Massachusetts, Beaver Brook, US, New Mexico, Albuquerque, US, Oregon, Hillsboro, US, Texas, Austin, US, Washington, Multiple CitiesBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
NewSilicon Packaging Engineering Manager IntelSilicon Packaging Engineering ManagerChandler, ArizonaJob Type: Experienced HireShift: Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations: US, California, Santa Clara, US, Oregon, HillsboroBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Bachelor's degree in Electrical Engineering or STEM related field with 9+ years of relevant experience OR- Master's degree in Electrical Engineering or STEM related field with 6+ years of relevant experience OR- PhD in Electrical Engineering or STEM related field with 4+ years of relevant experience.
Packaging Specialist Verano Holdings CorpPackaging SpecialistCoolidge, AZWhile performing the duties of this job, the employee is frequently required to remain in a stationary position, move and/or position oneself, communicate, operate and/or prepare, place, position objects, tools, or controls. As a Packaging Specialist, you are responsible accurately weighing, packing, and labeling cannabis flower, infused edibles, and cannabis extracts for shipment to retail dispensaries.
Advanced Packaging Supplier Technology Development Program Manager IntelAdvanced Packaging Supplier Technology Development Program ManagerChandler, ArizonaJob Type: Experienced HireShift: Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. This is a hands-on position that requires extensive work with supplier teams (through F2F meetings with local reps, phone/Teams meetings, and international travel to supplier factories), internal integration teams, and process module engineering teams to achieve new capacity qualification and ramp production on-time.
Packaging Machine Operator - Food Manufacturing Lactalis American Group, Inc.Packaging Machine Operator - Food ManufacturingCasa Grande, AZIn the US, we offer an unrivaled house of beloved brands, including Galbani Italian cheeses and ricotta, Président specialty cheeses and butters, Kraft natural and grated cheeses, Breakstones cottage cheese, Cracker Barrel, Black Diamond cheddar, and Parmalat milk. Our yogurt portfolio includes siggis, Stonyfield Organic, Brown Cow, Oui, Yoplait, Go-Gurt, ratio, Green Mountain Creamery, and Mountain High, along with sour cream and a growing family of ethnic favorites like Karoun, Gopi, and Arz.
Packaging Associate Gummi WorldPackaging AssociateChandler, ArizonaWe’re currently hiring Packaging Line Operators and Team Members who are excited to grow with us, thrive in a collaborative environment, and take pride in producing products that make a difference in people’s lives. Set up, operate, and monitor packaging machinery (bottle fillers, cappers, labelers, sealers, pouch fillers, etc.).
Test Module Development Engineer Intel CorpTest Module Development EngineerChandler, AZPrimary Focus: • Advanced semiconductor packaging technologies beyond conventional approaches • 3D packaging innovations and chiplet integration • High-performance computing packaging for data centers and AI applications • Heterogeneous integration across diverse chip technologies • Scaling packaging density while enhancing thermal and electrical performance. Test Module Development Engineer responsibilities include but are not limited to: • Executes test technology development and enablement for high-mix, low-volume testing and future technologies, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
Thermal data Analysis Engineer IntelThermal data Analysis EngineerChandler, ArizonaJob Type: Experienced HireShift: Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. PhD in Mechanical Engineering, Thermal Sciences, Aerospace Engineering, Chemical Engineering, or a related technical field; OR a Master's degree in one of these disciplines with 2+ years of experience in thermal engineering, thermal sciences, or a related field.