Troubleshoot excursions using FA data, cross-sections, and metrology (CD-SEM, profilometry, XRF, AOI) to root-cause defects such as TSV protrusion variation, via reveal non-uniformity, bump voiding, or co-planarity issues. Direct, hands-on experience with TSV reveal (grinding, CMP, dielectric reveal, thickness metrology) and C4 bumping (UBM, electroplating or solder ball attach, reflow).