Senior Associate, Mechanical Packaging Engineer L3Harris Technologies IncSenior Associate, Mechanical Packaging EngineerOrlando, FLSupport production, manufacturing, and integration activities through investigation and troubleshooting of engineering change requests (ECRs), build issues, and non-conformance concerns, while working with cross-functional teams to help identify solutions. Electro-mechanical equipment includes ruggedized enclosed electronic equipment, cables, printed wire boards (PWBs), circuit card assemblies (CCAs), mechanical components, and support equipment.
Packaging Engineer Associate PGS WorldwidePackaging Engineer AssociateOrlando, FL$27.45–$27.45 / hourThis role coordinates packaging and shipping requirements with program teams, suppliers, vendors, customers, and shipping personnel while supporting packaging documentation, hazardous material requirements, Special Packaging Instructions, and shipping process improvements. Experience supporting hazardous material identification, handling, labeling, marking, packaging, inventory, or shipment activities using SDS/MSDS information and applicable procedures.
Director of Advanced Packaging Process Engineering SkyWater Technology IncDirector of Advanced Packaging Process EngineeringKissimmee, FL$184,400–$276,600 / yearWe are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. In addition, they will closely collaborate with the Advanced Technology Services and Advanced Packaging Development Teams to create new manufacturing processes and capabilities, enabling the next generation of exciting new products to be manufactured at SkyWater.
Advanced Packaging Microelectronics Integration Engineer SkyWater Technology IncAdvanced Packaging Microelectronics Integration EngineerKissimmee, FL$158,960–$238,440 / yearGain / utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to create recipes that utilize temporary and permanent bonding, electrolytic / PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflows, flip chip, wire bond tools. We are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies.
Advanced Packaging Process Development Engineer - Staff SkyWater Technology IncAdvanced Packaging Process Development Engineer - StaffKissimmee, FL$95,200–$142,800 / yearHighly desirable for a candidate to have a background in at least one of the following areas: Wafer Singulation, Solder Bumping, Maskless Photolithography, PVD and/or CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology, Probe/Test (some areas may be combined). Major Areas of Accountability: Provide technical leadership and management of Advanced Packaging Semiconductor processes in Support of Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding.
Advanced Packaging Microelectronics Integration Engineer - Fan Out SkyWater Technology IncAdvanced Packaging Microelectronics Integration Engineer - Fan OutKissimmee, FL$158,960–$238,440 / yearGain / utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to create recipes that utilize temporary and permanent bonding, electrolytic / PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflows, flip chip, wire bond tools. We are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies.
Advanced Packaging Process Development Engineer - Principal SkyWater Technology IncAdvanced Packaging Process Development Engineer - PrincipalKissimmee, FL$136,960–$205,440 / yearHighly desirable for a candidate to have a background in at least one of the following areas: Wafer Singulation, Solder Bumping, Maskless Photolithography, PVD and/or CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology, Probe/Test (some areas may be combined). Major Areas of Accountability: Provide technical leadership and management of Advanced Packaging Semiconductor processes in support of Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding.
NewPackaging Operator AmcorPackaging OperatorOrlando, FLOur global product innovation and sustainability expertise enables us to solve packaging challenges around the world every day, producing a range of flexible packaging, rigid packaging, cartons and closures that are more sustainable, functional and appealing for our customers and their consumers. SUMMARY Performs repetitive production and packing operations to mass-procedure products such as preforms by performing the following duties.
Packaging Operator Amcor PlcPackaging OperatorOrlando, FLWhen you join Amcor, you will have access to a comprehensive benefits and compensation package that includes: • Medical, dental, and vision plans • Paid time off, starting at 40 hours per year for full-time hourly employees, may vary by location • Company-paid holidays starting at 8 days per year and may vary by location • Wellbeing programs & Employee Assistance Program • Health Savings Account/Flexible Spending Account • Life insurance, AD&D, short-term & long-term disability, and voluntary benefits • Paid Parental Leave • Retirement Savings Plan with company match • Tuition Reimbursement (dependent upon approval) • Discretionary bonus program (initial eligibility dependent upon hire date). • While performing the duties of this job, the employee is regularly required to use hands and fingers, handle, or feel; talk or hear; and taste or smell • The employee frequently is required to stand • The employee is occasionally required to sit; reach with hands and arms; climb or balance; and stoop, kneel, crouch, or crawl • The employee must frequently lift and/or move up to 25 pounds and occasionally lift and/or move up to 50 pounds • Specific vision abilities required by this job include close vision, and color vision.