Senior Laser Packaging Engineer ESRhealthcare and EXEC STAFF RECRUITERSSenior Laser Packaging EngineerSan Diego, CaliforniaDesign, develop, analyze, document, and assist in testing resilient, precision opto-mechanical assemblies and laser packages. You'll have the opportunity to work on cutting edge technologies, work closely with leadership, and develop and implement engineering practices that support our mission and growth.
Photonics Packaging Engineer ESRhealthcare and EXEC STAFF RECRUITERSPhotonics Packaging EngineerSan Diego, CaliforniaDesign, develop, analyze, document, and assist in testing resilient, precision opto-mechanical assemblies and laser packages. You'll have the opportunity to work on cutting edge technologies, work closely with leadership, and develop and implement engineering practices that support our mission and growth.
NewAdvanced Packaging Engineer SamtecAdvanced Packaging EngineerSan Diego, CaliforniaPuesto en Samtec, Inc Founded in 1976, Samtec is a privately held, $1 billion global manufacturer of broad line electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between.
Staff IC Packaging Engineer Qualcomm IncStaff IC Packaging EngineerSan Diego, CA$154,000–$231,000 / yearThe ideal candidate will possess deep expertise in advanced packaging architectures and assembly processes, and will lead technology development from concept through high-volume manufacturing (HVM) in collaboration with Outsourced Semiconductor Assembly and Test (OSAT) partners. Minimum Qualifications: Bachelor''s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
Sr. IC Packaging Engineer - Mechanical Simulation Qualcomm IncSr. IC Packaging Engineer - Mechanical SimulationSan Diego, CA$127,200–$190,800 / yearThis role offers unique opportunity to impact Qualcomm''s current/future chipsets using FEA expertise, working closely with design, new product introduction (NPI) and Chip-Package Interaction (CPI) teams by providing mechanical simulation support for current HVM and advanced packaging technologies. This role requires development of mechanical FEA models (preferably using ANSYS APDL and Workbench), maintain APDL macros/workflows, establish FEA methodologies/BKM for test correlation, material characterization, and performing stress/mechanical analysis for IC package designs and failure prediction.
Senior Packaging Design Engineer, Silicon Google LLCSenior Packaging Design Engineer, SiliconSan Diego, CA$163,000–$237,000 / yearCollaborate closely with Signal Integrity (SI), Power Integrity (PI), Test, New Product Introduction (NPI), and Mechanical Engineering teams to refine and optimize product package architecture and design. Skip navigation links home Home work_outline Jobs noogler_hat Students google How we work handyman How we hire person_outline Your career help_outline Help.
Photonics Process Development Engineer 2 Packaging and Tooling Monarch QuantumPhotonics Process Development Engineer 2 Packaging and ToolingSan Diego, California$85,000–$125,000 / yearYou will collaborate closely with device, optical, electrical, mechanical, and manufacturing engineers to transform delicate photonic designs into robust, manufacturable, high-yield products. 5+ years with demonstrated ownership of manufacturing process equipment such as die bonders, wire bonders, vacuum reflow systems, active alignment platforms, or laser welding systems.
Photonics Process Development Engineer 2 Packaging And Tooling Monarch QuantumPhotonics Process Development Engineer 2 Packaging And ToolingSan Diego, CA$85,000–$125,000 / yearYou will collaborate closely with device, optical, electrical, mechanical, and manufacturing engineers to transform delicate photonic designs into robust, manufacturable, high-yield products. 5+ years with demonstrated ownership of manufacturing process equipment such as die bonders, wire bonders, vacuum reflow systems, active alignment platforms, or laser welding systems.
Senior Photonics Process Development Engineer Packaging And Tooling Monarch QuantumSenior Photonics Process Development Engineer Packaging And ToolingSan Diego, CA$125,000–$175,000 / yearYou will collaborate closely with device, optical, electrical, mechanical, and manufacturing engineers to transform delicate photonic designs into robust, manufacturable, high-yield products. 3+ years of experience using manufacturing process equipment such as die bonders, wire bonders, vacuum reflow systems, active alignment platforms, or laser welding systems.
Senior Photonics Process Development Engineer Packaging and Tooling Monarch QuantumSenior Photonics Process Development Engineer Packaging and ToolingSan Diego, California$125,000–$175,000 / yearYou will collaborate closely with device, optical, electrical, mechanical, and manufacturing engineers to transform delicate photonic designs into robust, manufacturable, high-yield products. 5-10 years of experience using manufacturing process equipment such as die bonders, wire bonders, vacuum reflow systems, active alignment platforms, or laser welding systems.
Senior Engineer, NPI Packaging Murata Electronics North America, Inc.Senior Engineer, NPI PackagingSan Diego, CA$122,199.70–$158,868.41 / yearCollaborates with internal support personnel and other key supply chain partners including wafer fabs, offshore assembly and test contractors, and 3rd party service providers with service needs for specific technology or product developments. Familiarity with Microelectronic packaging technologies such as flip chip bumping, wafer backend processing, SMT, flip chip attach, flux cleaning, overmold, package marking, dicing, test, and packaging for shipment.
Senior ASICS Packaging Engineer Qualcomm IncSenior ASICS Packaging EngineerSan Diego, CA$129,165–$190,800 / yearGeneral Summary: This individual independently plans, performs the moderately-defined responsibility for new product development risk analysis, characterization, and mitigation of electronic packages working with internal design and engineering teams and external suppliers to ensure manufacturing readiness for volume production. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Senior Engineer, Oral Solid Dose Packaging Development Neurocrine Biosciences Inc.Senior Engineer, Oral Solid Dose Packaging DevelopmentSan Diego, CA$97,000–$133,000 / yearThe company's diverse portfolio includes FDA-approved treatments for tardive dyskinesia, chorea associated with Huntington's disease, classic congenital adrenal hyperplasia, hyperphagia in Prader-Willi syndrome, endometriosis and uterine fibroids , as well as a robust pipeline including multiple compounds in mid- to late-phase clinical development across our core therapeutic areas. Lead technical investigations for packaging related deviations, and nonconformances, and retain post launch technical ownership for lifecycle changes, troubleshooting, packaging vendors and CPO transfers, and continuous improvement in partnership with Packaging Operations.
Director, IC Packaging Engineering - Mechanical Simulation Qualcomm IncDirector, IC Packaging Engineering - Mechanical SimulationSan Diego, CA$227,300–$340,900 / yearThe Director will drive strategic alignment across IC package design/architecture, New Product Introduction (NPI), assembly, and Chip-Package Interaction (CPI) teams, ensuring high-quality mechanical simulation support across High Volume Manufacturing (HVM) and advanced packaging programs. Core technical responsibilities include overseeing the development and validation of mechanical FEA models (ANSYS APDL), establishing BKM methodology for test correlation and material characterization, and guiding stress/mechanical analysis for IC package designs.
Packaging SIPI Engineer, Sr. Staff Qualcomm IncPackaging SIPI Engineer, Sr. StaffSan Diego, CA$180,400–$270,600 / yearThe candidate is expected to communicate with PHY owners to understand the Specs for various IPs such as LPDDR, PCIe, UFS, USB, MIPI, etc., and with PCB designers to assess the impact of Ball assignment to the system level performance. Minimum Qualifications: Bachelor''s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.
Staff Failure Analysis Engineer - Advanced Packaging Technologies Qualcomm IncStaff Failure Analysis Engineer - Advanced Packaging TechnologiesSan Diego, CA$134,800–$202,200 / yearGeneral Summary: We are seeking a highly skilled and motivated Failure Analysis Engineer to lead the development and enablement of FA test interfaces, advanced socketing, and thermal management solutions in support of Electrical Fault Isolation (EFI). With the rapid emergence of Cloud, Compute, and Automotive products featuring large package sizes, high pin counts, and advanced packaging technologies, traditional design and process flows for FA testing are increasingly challenged.
Sr Staff or Principal Thermal Engineer, Server Packaging (San Diego) Qualcomm IncSr Staff or Principal Thermal Engineer, Server Packaging (San Diego)San Diego, CA$180,400–$270,600 / yearThe qualified individual will develop thermal solutions for server products at package and system levels resolving complex thermal management challenges related to high-performance servers. Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, conduct thermal design reviews and presentations.
OVERNIGHT PACKAGING TECH - CUTWATER Anheuser-BuschOVERNIGHT PACKAGING TECH - CUTWATERSan Diego, CAThey work as a valuable team member, and the position’s focus is on maintaining consistency and timeliness within the packaging function—all while maintaining high quality. The Packaging I is responsible for: can-filling machinery, bottle-filling machinery, boxing machinery, pallet wrapping machinery, and other general packaging operations.
Packaging Operator, San Diego-1 Athletic Brewing CompanyPackaging Operator, San Diego-1San Diego, CaliforniaWhile performing the duties of this job, the employee is regularly required to sit; stand; walk; use hands to finger, handle, or feel; reach with hands and arms; climb or balance; stoop, kneel, crouch, or crawl; talk or hear; and taste or smell. Able to master basic operations of each machine station including starting and stopping machines, station setup, how to change a date code, proper placement of trays, where to put glue in, and packaging into machinery.
Operator 1, Packaging Operations Katalyst Healthcares & Life SciencesOperator 1, Packaging OperationsSan Diego, CALearn and understand: Basic Packaging process flow, Basic Inventory and supplies management process flow, Basic bottling techniques for all single vial purified and conjugate materials, Basic packaging processes including bagging and labeling, Use of pipette, scale and other packaging equipment as required, Support label creation process by learning and operating all labeling equipment. The packaging technician gathers the materials required for their order: liquid bulk reagent (antibody or buffer), vials/bottles, caps, paperwork, labels and prepares and organizes the starting materials accurately and then presents the production order setup for line clearance.