Deep hands-on expertise in Flip-Chip BGA (FCBGA) and System-in-Package (SiP), RDL, silicon interposers, and chiplet architectures (UCIe)Strong understanding of electrical, mechanical, thermal, and reliability design trade-offs, Advanced packaging materials and substrate technologies, Design-for-Manufacturing (DFM) and yield optimizationDemonstrated ability to operate autonomously, make high-impact decisions, and execute in a startup environment. Axiado has also won numerousindustry awards for our ground-breaking products and technological innovations, includingbeing namedone ofFast Company's 2025 Top 10 Most Innovative Companiesin Security,winning the2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliance's 2025 “Start-Up to Watch” award.