Own well-scoped technical deliverables (characterization, modeling, failure analysis, product development) end-to-end 5% International travelMinimum requirement of a bachelors degreeMS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling Internship or research experience with a semiconductor company, OSAT, foundry, or academic packaging/materials lab. Youll partner with design, test, reliability, and product teams as well as foundry and OSAT partners, and grow over time into end-to-end ownership of well-scoped deliverables across characterization, modeling, and failure analysis.