Sr Packaging Engineer Imperative CareSr Packaging EngineerCampbell, CAFull timeWorking under general supervision, this individual will independently execute packaging development activities, support packaging validation efforts, coordinate supplier and laboratory activities, and contribute to the successful commercialization and lifecycle management of products. As a senior professional, this position support the design, development, validation, commercialization, and sustaining of sterile and non-sterile packaging systems for medical device and capital equipment products for Stroke, Vascular, and Robotics business units.
Packaging Engineer KLA CorporationPackaging EngineerMilpitas, CA$83,400–$141,800 / yearDemonstrated or detailed knowledge of packaging materials including paperboard, containerboard, plastic films, foam cushions, wood and lumber products, as well as their fabrication, conversion methodologies and application, cushion package design and the various types and characteristics of transportation/conveyance equipment, as well as typical application of equipment for product and packaging material handling and distribution. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world's leading technology providers to accelerate the delivery of tomorrow's electronic devices.
Senior Staff Packaging Engineer CyfleSenior Staff Packaging EngineerSan Jose, CaliforniaDrive alignment between module substrate (PCB) design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules. Collaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products.
Senior IC Packaging Engineer MicrosoftSenior IC Packaging EngineerMountain View, CA$119,800–$234,700 / yearDoctorate in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 3+ years technical engineering experience OR Masters Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 8+ years technical engineering experience OR equivalent experience. Doctorate in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 1+ year(s) technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 4+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 5+ years technical engineering experience OR equivalent experience.
Flexible Packaging Engineer BUNZLFlexible Packaging EngineerSalinas, CA$75,000–$80,000 / yearUnderstanding of the chemistry of poly urethane, poly vinyl, and poly olefin films, single direction and bi-directional shrink films, barrier and co extruded poly films is preferred. With more than 10,000 team members and over 400,000 supplies, Bunzl is recognized as a leading supplier across North America—and proudly certified as a Great Place to Work® .
NewQuantum 3D Integration and Packaging Engineer Applied Materials IncQuantum 3D Integration and Packaging EngineerSanta Clara, CA$147,000–$202,500 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.
NewQuantum 3D Integration And Packaging Engineer Applied MaterialsQuantum 3D Integration And Packaging EngineerSanta Clara, CA$147,000–$202,500 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.
Advanced Packaging Engineer DensityAIAdvanced Packaging EngineerMountain View, CA$200,000–$320,000 / year10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies. Demonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions.
NewFlexible Packaging Engineer Destiny Packaging Inc.Flexible Packaging EngineerSalinas, CAPart timeUnderstanding of the chemistry of poly urethane, poly vinyl, and poly olefin films, single direction and bi-directional shrink films, barrier and co extruded poly films is preferred. Experience with MAP, barrier films, laminated structures, COEX films, SUPs, flexo print, shrink, stretch, and poly bag structures is preferred.
NewSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and Integration Macpower Digital Assets Edge Private LimitedSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and IntegrationSanta Clara, CA$64 / hourIf you enjoy solving complex challenges in mixed-signal design, chiplet integration, and high-performance electronics , this role is for you. We are looking for a Senior Electrical Engineer with deep expertise in semiconductor design, advanced packaging, and ASIC development .
Staff Semi Packaging Engineer Analog DevicesStaff Semi Packaging EngineerSan Jose, CaliforniaADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
Principal Packaging Engineer Velaura AI IncPrincipal Packaging EngineerSunnyvale, CAStaff / Principal)On-site - Full-timeBangalore / Santa Clara, CADVApplyDesign Verification EngineerOn-site - Full-timeSanta Clara, CA / Austin, Texas / Boston, MAApplyDesign Verification Engineer- AI Accelerator LeadOn-site - Full-timeSanta Clara, CAApplyDesign Verification Engineer- CPUOn-site - Full-timeSanta Clara, CAApplySenior Design Verification EngineerOn-site - Full-timeSanta Clara, CAApplySenior Formal Verification EngineerOn-site - Full-timeSanta Clara, CAEmulationApplySenior Emulation EngineerOn-site - Full-timeSanta Clara, CAPerformanceApplyPerformance Modeling Architect - AI SystemsOn-site - Full-timeDurham, North Carolina / Santa Clara, CA / Boston, MA / Austin, TexasRTLApplyRTL DesignerOn-site - Full-timeSanta Clara, CAApplyRTL LeadOn-site - Full-timeSanta Clara, CAApplyRTL Power EngineerOn-site - Full-timeSanta Clara, CAApplySenior RTL EngineerOn-site - Full-timeSanta Clara, CASoftwareCompiler & ToolchainApplyAccelerator Compiler and Tool Chain LeadOn-site - Full-timeSanta Clara, CAPlatform SoftwareApplyPlatform Software Lead - Physical AIOn-site - Full-timeSanta Clara, CAApplyPrincipal AI SoC Runtime Software ArchitectOn-site - Full-timeSanta Clara, CA. Manager)On-site - Full-timeBangalore / Santa Clara, CAApplyPhysical Design Engineer (Staff / Sr.
Staff Engineer, Packaging Mechanical Simulation Samsung SemiconductorStaff Engineer, Packaging Mechanical SimulationSan Jose, CA$163,000–$253,000 / yearStrong technical‑writing skills, capable of producing clear, comprehensive documentation and communicating complex concepts to both technical and non‑technical audiences. You will collaborate with cross‑functional, multicultural teams to drive innovative packaging solutions, automate simulation workflows, and bridge the gap between numerical predictions and experimental validation.
Senior IC Packaging Development Engineer NvidiaSenior IC Packaging Development EngineerSanta Clara, CAWith competitive salaries and a generous benefits package, we are widely considered to be one of the technology world's most desirable employers; we have some of the most forward-thinking and hardworking people in the world working for us and, due to unparalleled growth, best-in-class teams are rapidly growing. This will include planning & driving related R&D with multiple internal and external partners and you will be responsible for establishing advanced packaging processes needed to meet our NPI goals regarding packaging turn-around-time, reliability, and chip-package interaction.
Packaging Design Engineer GooglePackaging Design EngineerSunnyvale, CAFrom software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. Utilize advanced Three-Dimensional/Two-Dimensional Computer-Aided Design software (SolidWorks, Artios CAD, Creo, etc.) to architect complex structural packaging solutions and generate precise technical drawings, assembly instructions, and cushion layouts.
FEA Packaging Engineer CspeedFEA Packaging EngineerPalo Alto, CaliforniaOur executive team has a demonstrated track record of building and scaling category-defining semiconductor and infrastructure businesses at companies like Broadcom, Lumentum, Tesla, Apple, Samsung, Intel, and VMware. Expert proficiency in one commercial FEA or CFD tool and working proficiency in a second covering the other domain — for example Ansys Mechanical or Abaqus alongside Icepak, Fluent, Flotherm, or Celsius.
Integrated Circuit - Packaging Architect Engineer Advanced Micro Devices, IncIntegrated Circuit - Packaging Architect EngineerSan Jose, CaliforniaSuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. Responsibilities: The Role : Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
Advanced Packaging Integration Engineer Applied MaterialsAdvanced Packaging Integration EngineerSanta Clara, CA$161,000–$221,000 / yearJoin the Photonics Platform Business Group at Applied Materials located in Santa Clara headquarters, work with a high caliber cross-functional research team to develop advanced packaging solutions for next-generation smart glasses and high‑performance optical interconnects. In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes.
Advanced Packaging Engineer — Fiber Array Integration CspeedAdvanced Packaging Engineer — Fiber Array IntegrationPalo Alto, CaliforniaA permanently bonded fiber array constrains the downstream flow in three respects: the engine cannot be optically qualified before fiber attach, a single failed channel scraps an assembly containing multiple high-value die, and manual fiber handling limits automation. This position owns the detachable optical interface for CspeedIO optical engines: the on-package element, the coupling optics, the alignment features, and the high-volume assembly process that joins fiber to engine without per-unit active alignment.
Packaging and Labeling Technician - Shockwave Medical 6947-SHOCKWAVE MEDICAL Legal EntityPackaging and Labeling Technician - Shockwave MedicalSanta Clara, CaliforniaAgile Manufacturing, Analytical Reasoning, Detail-Oriented, Equipment Maintenance, Good Manufacturing Practices (GMP), Issue Escalation, Manufacturing Equipment, Plant Operations, Predictive Maintenance, Problem Management, Process Oriented, Product Installation, Professional Ethics, Repair Management, Time Management, Troubleshooting . Employees and/or eligible dependents may be eligible to participate in the following Company sponsored employee benefit programs: medical, dental, vision, life insurance, short- and long-term disability, business accident insurance, and group legal insurance.