Sr. Packaging Engineer, Energy Tesla IncSr. Packaging Engineer, EnergyBrookshire, TXTesla is seeking a highly motivated Senior Packaging Engineer to join our Packaging team in developing world-class designs for use in automation equipment. The successful candidate must have the ability to work quickly and efficiently with a high level of precision have strong interpersonal and communication skills be detail oriented and not afraid to re-define tradition.
Sr. Packaging Engineer Tesla IncSr. Packaging EngineerAustin, TXThe successful candidate must have the ability to work quickly and efficiently with a high level of precision, have strong interpersonal and communication skills, be detail oriented, and not afraid to re-define tradition. Tesla is seeking a highly motivated Packaging Engineer to join our Packaging team in developing world-class designs for automation equipment.
NewSenior IC Packaging Engineer Microsoft CorpSenior IC Packaging EngineerAustin, TX$119,800–$234,700 / yearPreferred Qualifications: Doctorate in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 3+ years technical engineering experience OR Masters Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 8+ years technical engineering experience OR equivalent experience. Required Qualifications: Doctorate in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 1+ year(s) technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 4+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 5+ years technical engineering experience OR equivalent experience.
NewPrincipal Packaging Engineer The Sterling ChoicePrincipal Packaging EngineerEl Paso, TX$130,000–$160,000 / yearThere's a strong team around you, but this role still requires genuine presence on the floor and the confidence to lead from the front.8+ years in packaging development or procurement — ideally in foodSkilled in project and supplier management, spec development, and packaging systemsExperienced working across multiple sites or regionsComfortable balancing day-to-day leadership with longer-term strategic workThe business has grown rapidly over the last 3 years — and the momentum is only increasing. Seniority level Seniority level Mid-Senior levelEmployment type Employment type Full-timeJob function Job function Science, Project Management, and Product ManagementIndustries Food and Beverage Manufacturing and Food and Beverage ServicesReferrals increase your chances of interviewing at The Sterling Choice by 2xGet notified about new Packaging Engineer jobs in El Paso, TX.
NewSenior Packaging Engineer Staff PermSenior Packaging EngineerRichardson, TXThis role is critical to enabling damage-free transportation by engineering packaging solutions that withstand real-world handling, cross-docking, forklift interaction, vibration, and edge impact. Staff Perm is an Award Winning and Certified Small Business Enterprise utilizing a staff with over 20 years of staffing and placement experience to simplify the employee recruitment process.
NewPackaging Engineer: Design, Optimize & Scale Central Garden & PetPackaging Engineer: Design, Optimize & ScaleDallas, TXThe ideal candidate will have a bachelor's degree in Packaging Engineering or a closely related field, along with experience in both manufacturing support and product development. A leading company in life sciences based in Dallas, TX seeks a Packaging Engineer to design and optimize packaging solutions.
Senior Staff Packaging Engineer Celestica IncSenior Staff Packaging EngineerTXToday, Celestica delivers innovative supply chain solutions globally to customers in strategic two operating and reporting segments: Advanced Technology Solutions (ATS) and Connectivity and Cloud Solutions (CC): ATS: This segment serves customers in complex, regulated and high-reliability markets such as Industrial & Smart Energy, Aerospace & Defense, Semiconductor Capital Equipment, and HealthTech. Backed by comprehensive capabilities and a global network across North America, Europe and Asia, Celestica helps customers gain competitive advantage with the quality, flexibility and resiliency they need to respond quickly to shifts in demand.
Packaging Engineer Associate - HYBRID The Structures Company, LLCPackaging Engineer Associate - HYBRIDGrand Prairie, TX1–3 years of experience working with engineering design data, product data management systems, MCAD tools, CREO, Pro/E, or similar to support packaging design or Packaging Data Content. Works with engineering design data, product data management systems, and MCAD tools (CREO, Pro/E) to support packaging design and Packaging Data Content.
Packaging engineer Info Way Solutions LLCPackaging engineerAustin, TXsuccessful candidate must have the ability to work quickly and efficiently with a high level of precision, have strong interpersonal and communication skills, be detail oriented, and not afraid to re-define. • Apply industrial design techniques of CAD, technical drawings, including datum structure, GD&T and tolerance stack up analysis.
High Voltage Semiconductor Packaging Engineer - Onsite Genesis10High Voltage Semiconductor Packaging Engineer - OnsiteDallas, TXFull timeThis role focuses on defining, designing, and developing high-voltage and high-power packages and modules for the Industrial, Automotive, Renewable, and Telecom markets, scaling them from concept to high-volume production. Ranked a Top Staffing Firm in the U.S. by Staffing Industry Analysts for six consecutive years, Genesis10 puts thousands of consultants and employees to work across the United States every year in contract, contract-for-hire, and permanent placement roles.
NewPackaging Engineer The Sterling ChoicePackaging EngineerEl Paso, TX$90,000–$120,000 / yearSeniority level Seniority level Mid-Senior levelEmployment type Employment type Full-timeJob function Job function Science, Project Management, and Product ManagementIndustries Food and Beverage Services and Food and Beverage ManufacturingReferrals increase your chances of interviewing at The Sterling Choice by 2xGet notified about new Packaging Engineer jobs in El Paso, TX. - $120,000.00/yrDirect message the job poster from The Sterling ChoiceGlobal FSQA and R&D Executive Search Consultant Salary: $90,000 - $120,000 + BonusThis food manufacturing group is scaling fast, with eight sites across the US and Mexico — and packaging innovation is central to their strategy.
Silicon Packaging Process Engineer, Production Starlink Space Exploration Technologies CorpSilicon Packaging Process Engineer, Production StarlinkTXDevelop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, surface mount technology (SMT), flip chip, bonding, molding, underfill, dispense, sputter, lid attach, solder ball attach, and advanced packaging processes. ITAR REQUIREMENTS: To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State.
NewLead Silicon Photonics Packaging Engineer Apple, Inc.Lead Silicon Photonics Packaging EngineerAustin, TXThe role includes designing silicon photonic devices to optimize coupling and performance, working with cross-functional teams, and developing packaging solutions. Apple Inc. is seeking a Silicon Photonics & Optical Packaging Engineer in Austin, Texas, to develop optical I/O module architecture and assembly solutions.
Packaging Engineer Amphenol Fiber Systems InternationalPackaging EngineerAllen, TXThe Packaging Engineer will design develop validate and optimize packaging solutions that ensure product protection cost-efficiency regulatory compliance and logistics performance for Amphenol Fiber Systems products across global supply chains. • Support development of product and shipping package labeling • Perform and/or coordinate packaging tests drop vibration compression atmospheric and transport simulation ISTA ASTM ISTA 1A3A6 ASTM D4169 etc.
Packaging Engineer United 1 LaboratoriesPackaging EngineerCarrollton, TexasDevelop and maintain packaging specifications, BOMs, and engineering change orders in ERP systems; review and approve technical drawings and specification documents. Manage assigned workload through effective time management, planning, and coordination of projects to ensure that the required deadlines are met.
NewSenior FCBGA Packaging Engineer for SoC NPI to Volume Apple, Inc.Senior FCBGA Packaging Engineer for SoC NPI to VolumeAustin, TXThe position offers competitive challenges in a dynamic environment focused on cutting-edge technologies.#J-18808-Ljbffr. A leading technology company in Austin, Texas is seeking an IC Packaging Assembly Engineer.
Packaging Engineer Central Garden & PetPackaging EngineerDallas, TXFull timeCentral is home to a diversified portfolio of market-leading brands including Amdro®, Aqueon®, Best Bully Sticks®, Cadet®, C&S®, Farnam®, Ferry-Morse®, Kaytee®, Nylabone®, Pennington®, Sevin® and Zoёcon®. WORKING CONDITIONS The primary working environment is an office, complete with Engineering tools such as a computer, CAD/CAM software, TOPPS, data analysis tools and measuring devices.
NewIC Packaging Integration Engineer Apple, Inc.IC Packaging Integration EngineerAustin, TXDescriptionYou will be responsible for IC packaging developmentWork with cross‑functional teams and lead SoC Package integration and architecture effortsDrive the industry with advanced package solutions, new material developments, and specsResponsibilitiesWork with cross-functional domains through package definition process and deliver optimized solutions to meet electrical, mechanical, thermal requirements. Test vehicle definition and execution working alongside foundries and OSATs for advanced packaging technologies (FOWLP, 2.5D, 3D, coreless MCM).Well versed with DOE principles and statistical analyses to establish robust build plans for OSATs through NPI phase.
Silicon Photonics & Optical Packaging Engineer Apple IncSilicon Photonics & Optical Packaging EngineerTXIn this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM.
NewSenior Packaging Engineer: Innovation & Optimization NavistarSenior Packaging Engineer: Innovation & OptimizationSan Antonio, TXNavistar, Inc. is seeking a Senior Packaging Analyst in San Antonio, Texas, to design and optimize packaging solutions supporting safe and efficient material flow in the supply chain. The successful candidate will collaborate with internal teams and suppliers for new product launches and continuous improvements in packaging strategies.
Associate Packaging Equipment Engineer Alcon IncAssociate Packaging Equipment EngineerHouston, TXThe Associate Packaging Equipment Engineer is primarily responsible for analyzing technological trends, designing and modifying processes, and resolving engineering issues to enhance team performance and operational efficiency at our Manufacturing Facility in Houston, TX. This role is part of Alcon's Engineering function, a team focused on improving quality, processes, products, packaging and materials across our business to help deliver brilliant outcomes.
Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs Amazon.com IncSr. Thermal & Mechanical Packaging Engineer, Annapurna LabsAustin, TXYou develop from the lowest levels of circuit design to large system design including thermal and mechanical solutions and see those systems all the way through to high volume manufacturing. You'll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience.
NewIntegrated Circuit - Packaging Architect Engineer Advanced Micro DevicesIntegrated Circuit - Packaging Architect EngineerAustin, TXThe successful candidate will collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. The PersonThe candidate should have a proven track record of driving technology development in the semiconductor field and leadership experience driving engineering teams in architecture definition, process definition and/or yield improvement.
NewSenior Multiphysics IC Packaging Engineer University of Texas at AustinSenior Multiphysics IC Packaging EngineerAustin, TXA prestigious educational institution in Austin, Texas is seeking an experienced professional for a role in semiconductor packaging involving multiphysics simulations and interconnect modeling. This role involves collaboration with engineering teams and vendors to develop and refine simulation workflows.
NewSenior IC Packaging & SoC Integration Engineer Apple, Inc.Senior IC Packaging & SoC Integration EngineerAustin, TXThe role involves collaboration across teams to meet stringent performance specs while fostering a diverse and inclusive work environment.#J-18808-Ljbffr. We seek candidates with a strong background in semiconductor packaging, proven problem-solving abilities, and expertise in advanced packaging techniques.
Mechanical Engineer, Packaging Engineering Tesla IncMechanical Engineer, Packaging EngineeringAustin, TXYou will serve as a highly technical contributor on the team responsible for design, optimization, prototyping and validation of new ways to deliver components safely and efficiently throughout our supply chain and manufacturing processes. Tesla is seeking a highly motivated Mechanical Design Engineer to join our Vehicle Packaging team in developing world-class designs for use in high volume automation equipment.
Thermal Mechanical Test Engineer, Silicon Packaging Starlink Space Exploration Technologies CorpThermal Mechanical Test Engineer, Silicon Packaging StarlinkBastrop, TXWe provide reliable and fast internet to millions of users worldwide, including populations with little or no connectivity, rural communities, aircraft, watercraft, and places where existing services are unreliable, too expensive, or disconnected by natural disasters. You will support the silicon packaging process engineering organization by characterizing package and board thermal performance, validating mechanical robustness, and correlating simulation results with physical test data to enable high-volume production of reliable Starlink hardware.
Advanced Packaging Process Engineer, Silicon Technology Starlink Space Exploration Technologies CorpAdvanced Packaging Process Engineer, Silicon Technology StarlinkTXRESPONSIBILITIES: • Own packaging assembly processes from concept to mass production, including equipment and material selection for wafer-level and chip-level systems • Develop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach, and next-generation panel-level packaging processes • Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines • Own packaging prototypes, product development, and release to production • Select equipment and material to meet quality, reliability, cost, yield, and production targets • Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements • Cross-functional interface with silicon design, materials, thermal, systems, and production teams • Implement advanced packaging solutions into SpaceX next generation products on Earth, in orbit, and beyond. BASIC QUALIFICATIONS: • Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other engineering discipline • 1+ years working with semiconductor packaging processing equipment, silicon, microelectronics, or packaging design (internship experience applicable).
Sr. Silicon Packaging Process Engineer, Silicon Technology Starlink Space Exploration Technologies CorpSr. Silicon Packaging Process Engineer, Silicon Technology StarlinkTXDevelop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach. ITAR REQUIREMENTS: To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State.
Silicon Packaging Process Engineer, Silicon Technology Starlink Space Exploration Technologies CorpSilicon Packaging Process Engineer, Silicon Technology StarlinkTXRESPONSIBILITIES: • Own packaging assembly processes from concept to mass production, including equipment and material selection for wafer-level and chip-level systems • Develop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach, and next-generation panel-level packaging processes • Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines • Own packaging prototypes, product development, and release to production • Select equipment and material to meet quality, reliability, cost, yield, and production targets • Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements • Cross-functional interface with silicon design, materials, thermal, systems, and production teams • Implement advanced packaging solutions into SpaceX next generation products on Earth, in orbit, and beyond. BASIC QUALIFICATIONS: • Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other engineering discipline • 1+ years working with semiconductor packaging processing equipment, silicon, microelectronics, or packaging design (internship experience applicable).
Lead Silicon Packaging Technician, Silicon Assembly Starlink Space Exploration Technologies CorpLead Silicon Packaging Technician, Silicon Assembly StarlinkBastrop, TXOperate and maintain surface mount technology, automated optical inspection, reflow, aqueous deflux, convection and vacuum bake, compression molding, laser marking, ball grid array, tape mount, singulation, physical vapor deposition, vision, and pick/place machines. Operate die attach equipment, including epoxy dispensers, pick-and-place bonders, and reflow stations, to place and secure dies with micron-level accuracy and controlled bond line thickness.
Silicon Packaging Technician, Silicon Assembly Starlink Space Exploration Technologies CorpSilicon Packaging Technician, Silicon Assembly StarlinkBastrop, TXalign, bake, coat, expose, develop), electrochemical plating, die Attach, thermal compression bonding, compression molding/overmold, wafer dicing, scribe & break, stripping/etching, plasma, reactive ion etching (RIE), thin films deposition (CVD/PVD/ALD), dry film lamination & imaging. Operate photolithography tools, such as photoresist coaters, aligners, steppers, scanners, and developers, to apply uniform resist layers, align products, expose patterns, and develop images with precision accuracy.
Packaging Prototype & Lab Technician Keurig Dr Pepper IncPackaging Prototype & Lab TechnicianFrisco, TX$19.47–$24.80 / hourJob Overview: We are seeking a hands-on Packaging Lab Technician to support our Packaging Engineering team by maintaining lab operations, equipment, and materials, while enabling efficient execution of testing and development activities. Company Overview: Keurig Dr Pepper (Nasdaq: KDP) is a leading beverage company with more than 150 owned, licensed and partner brands that meet a wide range of needs and occasions.
NewPackaging Engineer II Mary Kay IncPackaging Engineer IILewisville, TXJob Summary: Under general direction and guidance, supports, coordinates and/or performs activities that evaluate packaging components and package materials for Mary Kay Inc. products and technologies during new product development for market launch and/or continued product line maintenance. They provide the products, marketing and other support to millions of Independent Beauty Consultants (IBCs) who work as independent contractors, selling our products directly to consumers in nearly 40 markets on five continents.
NewElectronic Packaging Engineer for Radar/UAS Systems L3Harris TechnologiesElectronic Packaging Engineer for Radar/UAS SystemsPlano, TXCandidates require a Bachelor's Degree along with relevant experience in packaging electronics and knowledge of military environment testing. The position emphasizes teamwork, strong communication skills, and proficiency in 3D CAD modeling.
Packaging Engineer I YETI CoolersPackaging Engineer IAustin, TexasWork cross functionally with Program Managers, Product Managers, Design & Industrial Engineering, Marketing, Merchandising, Sourcing, Operations, International team members, packaging and manufacturing suppliers to execute on-time packaging solutions. As a Packaging Engineer, you will support the design and development of premium out-of-box experiences for YETI products while considering performance, sustainability, and cost; ensuring YETI packaging delivers our premium brand aesthetic throughout its full lifecycle.
AI Automation Design Packaging Lead Advanced Micro Devices IncAI Automation Design Packaging LeadAustin, TXTHE PERSON: The successful candidate must be a proven leader and a technical innovator who can bridge the gap between physical design requirements and software automation to generate AI driven workflows. THE ROLE: We are looking for a forward-thinking candidate to drive and lead the team for the development and deployment of next-generation packaging design automation and AI-Driven workflows.
Advanced Packaging Engineer - SI/PI Marvell Technology IncAdvanced Packaging Engineer - SI/PIAustin, TX$97,630–$146,300 / yearHighlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. Expected Base Pay Range (USD) $97,630 - $146,300 per annum The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions.
NewLead Substrate Packaging Engineer Innovation & Roadmap Apple, Inc.Lead Substrate Packaging Engineer Innovation & RoadmapAustin, TXApple Inc. is seeking a qualified individual in Austin, Texas, to lead the development of SoC package substrate technologies for its hardware technology team. This role involves working with cross-functional groups and industry partners to optimize packaging solutions.
Senior Packaging Designer Dell Technologies IncSenior Packaging DesignerAustin, TXThe Senior Packaging Designer will collaborate closely with Industrial Designers, Packaging Engineers, CMF teams, the Brand team, Software team and other partners to interpret design requirements and execute cohesive solutions. Develop high-quality design assets across packaging, product interfaces, marketing, and communications, including graphics, branded elements, wallpapers, and digital content such as short-form videos and animations.
Packaging Engineer Weekday AIPackaging EngineerDallas, TexasThis position will support engineering efforts related to processing, packaging, and utility systems, managing projects from initial concept to final commissioning. Key Responsibilities: Oversee capital projects (CAPEX) through all phases including planning, design, budgeting, execution, and completion.
Global Process Engineer - Packaging, Material Transport, Material Handling GE Vernova IncGlobal Process Engineer - Packaging, Material Transport, Material HandlingHouston, TX$104,600–$174,400 / yearGE Vernova Inc. or its affiliates (collectively or individually, "GE Vernova") sponsor certain employee benefit plans or programs GE Vernova reserves the right to terminate, amend, suspend, replace, or modify its benefit plans and programs at any time and for any reason, in its sole discretion. Define, control, communicate global processes for manufacturing assets, including: facility integration, acceptance testing, machine health checks & calibrations, preventative maintenance plans, spare parts strategy, technical & technology training.
Packaging Engineer I YETI Coolers, LLCPackaging Engineer IAustin, TXWork cross functionally with Program Managers, Product Managers, Design & Industrial Engineering, Marketing, Merchandising, Sourcing, Operations, International team members, packaging and manufacturing suppliers to execute on-time packaging solutions. As a Packaging Engineer, you will support the design and development of premium out-of-box experiences for YETI products while considering performance, sustainability, and cost; ensuring YETI packaging delivers our premium brand aesthetic throughout its full lifecycle.
NewPackaging Assembly Engineer Apple, Inc.Packaging Assembly EngineerAustin, TXIn this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC.Description Responsible to lead packaging assembly technology development. Responsibilities Define and optimize end‑to‑end FCBGA assembly process flow (wafer back‑end interface, flip‑chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).Develop and maintain process documentation including process specs, work instructions, control plans, PFMEA, and process flow diagrams.
NewPackaging Development Engineer Impact The Sterling ChoicePackaging Development Engineer ImpactEl Paso, TX$90,000–$120,000 / yearThe ideal candidate will have solid experience in packaging engineering or procurement, be bilingual in English and Spanish, and have knowledge of packaging equipment. A leading food manufacturing group in El Paso, TX, is seeking a Global FSQA and R&D Executive Search Consultant.
Test Engineer, Packaging Product Design Apple IncTest Engineer, Packaging Product DesignAustin, TXThe Packaging PD team is a diverse group of people responsible for the design and execution of structural packaging for all Apple products, from shippers to finished goods boxes. Apple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
NewPackaging Product Design Engineer Apple, Inc.Packaging Product Design EngineerAustin, TXThe Packaging PD team is a diverse group of people responsible for the design and execution of structural packaging for all Apple products - from shippers to finished goods boxes. Apple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
NewSr. Project Engineer (Packaging) Barry-Wehmiller CompaniesSr. Project Engineer (Packaging)San Antonio, TXComplete packaging line design and development—estimation, justification, budgeting, scheduling, design, implementation, acquisition, installation, start‑up, troubleshooting, and documentation—ensuring compliance with local, state, federal, and international regulations. Project Engineer Lead project ownership for packaging equipment design, automation solutions, and continuous improvement initiatives across diverse industrial sectors.
Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging Amazon.com IncPackage Layout Design Engineer , Annapurna Labs - AI Silicon PackagingAustin, TXIn this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets. Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
IC Packaging Simulation Engineer Apple IncIC Packaging Simulation EngineerTXIn this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability. Numerical modeling of the stress and deformation of component packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.