Senior IC Packaging Engineer Axiado CorpSenior IC Packaging EngineerSan Jose, CAAxiado has also won numerous industry awards for our ground-breaking products and technological innovations, including being named one of Fast Companys 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliances 2025 Start-Up to Watch award. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management.
Packaging Engineer Manpower EngineeringPackaging EngineerFremont, CATemporaryManpowerGroup® (NYSE: MAN), the leading global workforce solutions company, helps organizations transform in a fast-changing world of work by sourcing, assessing, developing, and managing the talent that enables them to win. We are recognized consistently for our diversity - as a best place to work for Women, Inclusion, Equality and Disability and in 2023 ManpowerGroup was named one of the World's Most Ethical Companies for the 14th year - all confirming our position as the brand of choice for in-demand talent.
Photonic Packaging Engineer, Principal Astera Labs IncPhotonic Packaging Engineer, PrincipalSan Jose, CAAstera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
Internship, Packaging Engineer, Supply Chain (Fall 2026) Tesla IncInternship, Packaging Engineer, Supply Chain (Fall 2026)Fremont, CA$16.35–$33.65 / hourConsider before submitting an application: This position is expected to start August 2026 or September 2026 and continue through the Fall term (ending approximately December 2026 or later, if available). Demonstrated ability to facilitate dynamic cross-functional projects with engineering, supply chain, manufacturing and test to meet project timelines.
Packaging Engineer Nexthop Systems IncPackaging EngineerSanta Clara, CAQualification plans to characterize and validate packaging solutions for product and it's FRU (Field replaceable unit), subassemblies or components as per industry or internal specifications by working closely with HW design (mechanical, thermal, electrical etc.) Come out with innovative ideas for cost optimization, durability during shipping, environmental impact, and compliance with safety regulations. In this role, you'll combine technical expertise with innovative problem-solving to plan & execute all qualifications activities for cutting-edge packaging designs, ensuring they meet the stringent demands of all global shipping environments.
Memory Packaging Engineer Apple IncMemory Packaging EngineerSanta Clara, CAMinimum requirement of a bachelors degree in a relevant fieldMS or PhD preferred, with 3+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages. If you are driven to solve the industrys toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.
Packaging Engineer - Ripon The Wine GroupPackaging Engineer - RiponRipon, CAFull timeHeadquartered in Livermore, California, TWG is an industry innovator when it comes to developing, marketing, and selling wine brands beloved by consumers around the world, including Cupcake, Franzia, Benziger, Imagery, Tribute, 7 Deadly, Cooper & Thief, The Dreaming Tree, Charles Smith Wines, and more. The Packaging Engineer will support TWG innovation goals with pro-active research, identification, and assessment of cutting-edge consumer packaging solutions across all beverage container industries, gauging suitability to TWG requirements and capabilities.
NewOptic-Electronic Packaging Engineer Dormont Manufacturing CompanyOptic-Electronic Packaging EngineerSan Jose, CAKey ResponsibilitiesDesign and develop mechanical packaging solutions for high‑speed optical modules used in AI and data center interconnect systemsDrive mechanical concepts from architecture definition through detailed design, prototype build, validation, and production rampDevelop detailed 3D CAD models and engineering documentationPerform advanced thermal and mechanical stress analysis (FEA) to address high power density, airflow constraints, and long‑term reliabilityOwn GD&T definition and tolerance stack‑up analysis for high‑density opto‑electro‑mechanical assembliesDesign fixtures, tooling, and test infrastructure to support optical alignment, module validation, and scalable manufacturingCollaborate closely with optical, electrical, thermal, reliability, manufacturing, and supply‑chain teams to deliver integrated, system‑aware solutionsFor senior‑level engineers: provide technical direction, review designs, mentor junior engineers, and influence mechanical and thermal platform strategyQualificationsB.S. in Mechanical Engineering or a related discipline (M.S. or Ph. Mechanical Engineer (All Levels – AI & Data Center Optical Modules)Department: Research & DevelopmentLocation: San Jose, California, USAPosition OverviewWe are seeking Mechanical Engineers to support the design and development of next‑generation high‑speed optical modules for AI and data center interconnect applications.
Principal Packaging Engineer Skyworks Solutions IncPrincipal Packaging EngineerSan Jose, CAAt Skyworks you will find a fast-paced environment with a strong focus on global collaboration minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creative thinking. Experience in package design and proficient in Cadence Allegro platform tools, PCB Editor, Advanced Package Designer, APDSiP, or Mentor Xpedition platform tools.
Sr Packaging Engineer Applied Materials IncSr Packaging EngineerSanta Clara, CA$133,500–$183,500 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
Packaging Engineer Analog Devices IncPackaging EngineerSan Jose, CA$86,480–$118,910 / yearADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
NewSenior Packaging Engineer, NPI & Global Ops (Semiconductors) Analog DevicesSenior Packaging Engineer, NPI & Global Ops (Semiconductors)San Jose, CAAnalog Devices, Inc. is seeking a highly motivated Senior Packaging Engineer in San Jose, CA to work on package development and deployment within our New Product Introduction pipeline. Ideal candidates will have a Master's degree and 3-4 years in a relevant field, with strong analytical and problem-solving skills to drive project outcomes effectively.
Staff Semi Packaging Engineer Analog Devices IncStaff Semi Packaging EngineerSan Jose, CA$130,168–$188,490 / yearADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
Advanced Packaging Process Engineer Tenstorrent IncAdvanced Packaging Process EngineerSanta Clara, CAPartner with design, reliability, and architecture teams to evaluate tradeoffs (bump pitch, stack-ups, embedded Si, etc.) and lead test vehicle planning to meet program needs. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.
NewSenior IC Packaging Engineer - Design & Reliability Dormont Manufacturing CompanySenior IC Packaging Engineer - Design & ReliabilitySan Jose, CADormont Manufacturing Co is seeking a Senior Engineer for Semi Packaging Engineering in San Jose, California. This full-time position requires a Master's degree in Mechanical Engineering or related field and a minimum of two years of experience.
Sr. Industrial Designer (Packaging) SanDisk CorpSr. Industrial Designer (Packaging)Milpitas, CAAn employee's pay position within the salary range may be based on several factors including but not limited to (1) relevant education; qualifications; certifications; and experience; (2) skills, ability, knowledge of the job; (3) performance, contribution and results; (4) geographic location; (5) shift; (6) internal and external equity; and (7) business and organizational needs. Sandisk is looking for a Senior Packaging Industrial Designer to join global industrial design team to design 3D structural packaging solutions for world‑class consumer storage products.
Associate Optical Packaging Engineer PsiQuantum CorpAssociate Optical Packaging EngineerMilpitas, CA$85,000–$120,000 / yearOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate''s qualifications including relevant education and training, competencies, experience, geographic location, and business needs.
NewSenior Packaging Engineer 3D/TSV, Equity ESR HealthcareSenior Packaging Engineer 3D/TSV, EquitySan Jose, CAThis exciting role involves working on mechanical designs for advanced electronic packaging and optical components. Applicants should have a B.S. or M.S. in a relevant engineering field and be proficient in Solidworks.
Advanced Packaging Engineer - SI/PI Marvell Technology IncAdvanced Packaging Engineer - SI/PISanta Clara, CA$97,630–$146,300 / yearHighlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. Expected Base Pay Range (USD) $97,630 - $146,300 per annum The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions.
NewIntegrated Circuit - Packaging Architect Engineer Advanced Micro DevicesIntegrated Circuit - Packaging Architect EngineerSan Jose, CAResponsibilities Work with product architects in early definition stage to understand and define package architectures, roadmapLead new package technology development initiatives from concept to full technology qualificationDrive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelinesEstablish Yield roadmap and lead implementation of yield, data analytic tools as needPreferred Experience Experience in semiconductor technology development roleExperience working with manufacturing partners such as suppliers, OSATs and foundry partners. In-depth knowledge in material science, thin film process development, and/or packagingExperience in a leadership role driving cross-functional teamsProven track record of driving yield improvement, defect reduction in semiconductor fab or packaging environmentEducation BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalentThis role is not eligible for visa sponsorship.#LI-HYBRID#LI-AP1Benefits offered are described: AMD benefits at a glance.
NewOptoelectronic Packaging Engineer - AI Data Center Dormont Manufacturing CompanyOptoelectronic Packaging Engineer - AI Data CenterSan Jose, CA$130,850–$186,900 / yearDormont Manufacturing Co in San Jose, California is seeking a Mechanical Engineer to design innovative optical modules for AI and data center applications. Ideal candidates will have a B.S. in Mechanical Engineering, proficiency in tools like SolidWorks, and experience in a fast-paced R&D environment.
Sr. Principal Engineer, Advanced Packaging Marvell Technology IncSr. Principal Engineer, Advanced PackagingSanta Clara, CAThe group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Foundry Services Advanced Packaging Account Technical Solutions Engineer Intel CorpFoundry Services Advanced Packaging Account Technical Solutions EngineerSanta Clara, CA$220,320–$311,040 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
Co-Packaged Optics Packaging Process Development Engineer Marvell Technology IncCo-Packaged Optics Packaging Process Development EngineerSanta Clara, CAWork with cross-functional packaging teams and lead process development at foundry along with 2.5D/3D CoW process development with particular emphasis on chemistry development with packaging consumable suppliers at OSATs to bring packaging solutions from concept to prototypes and ramp to high volume manufacturing with aggressive cost reduction strategies. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Technologist, Packaging Engineering SanDisk CorpTechnologist, Packaging EngineeringMilpitas, CAProvide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), influencing product architecture and manufacturing strategy at the system level. ESSENTIAL DUTIES AND RESPONSIBILITIES: Serve as the senior Package Engineering representative on cross‑functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements.
NewSenior Engineer, Semi Packaging Engineering Dormont Manufacturing CompanySenior Engineer, Semi Packaging EngineeringSan Jose, CA$132,142–$164,910 / yearSenior Engineer, Semi Packaging EngineeringJob Requisition: 1010.1551.2 / R262672Job Location: San Jose, CaliforniaJob Type: Full TimeRate of Pay: $132,142 - $164,910 per yearJob Req Type: ExperiencedRequired Travel: NoShift Type: 1st Shift/DaysDutiesWork with cross‑functional team to develop advanced integrated circuit ("IC") packaging solutions that include design, material selections, qualification, and release‑to‑manufacturing for various product groups. RequirementsMust have a Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Autonomy and Robotics Engineering, or related field (willing to accept a foreign education equivalent) and two (2) years of experience as a Packaging Engineer or related occupation conceptualizing and productizing semiconductor devices to bridge analog signals to digital Cloud.
Sr. Packaging Engineer NEXTracker IncSr. Packaging EngineerFremont, CA$160,000–$175,000 / yearThis role goes beyond traditional packaging design, focusing on end-to-end packaging systems, including returnable packaging, reverse logistics, cost modeling, and network-wide performance. Our talented worldwide teams are redefining how solar power plants are designed, built, and operated every day with smart technology, data-driven insights, and advanced automation.
Memory Packaging Engineer MediaTek IncMemory Packaging EngineerSan Jose, CACollaborate closely with IP, ASIC design, package design, Signal Integrity (SI), Power Integrity (PI), Thermal and modeling technologies, Product Engineering, and Test Engineering teams to enable innovative solutions. Roles and Responsibilities: Supports MediaTek's Memory packaging technology development including but not limited to HBM package, cHBM, LPDDR package for mobile applications, In Package Memory (IPM) for Edge AI, etc.
Semiconductor Packaging Modeling and Simulation Engineer onsemiSemiconductor Packaging Modeling and Simulation EngineerSan Jose, CAWith a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.
NewAdvanced Packaging SI/PI Engineer ETCHED LLCAdvanced Packaging SI/PI EngineerSan Jose, CAKey ResponsibilitiesSI/PI analysis of designs and optimization within 2D/2.5D/3D packagesClose interaction with Package Layout Designers, ASIC PD and IP teams as well as Board Schematic/Layout/SI/PI teams to optimize the best electrical performanceDrive SI requirements into interposer/substrate layout (high‑speed routing: 112G/224G) from preliminary design through tape‑out. BenefitsMedical, dental, and vision packages with generous premium coverage$500 per month credit for waiving medical benefitsHousing subsidy of $2k per month for those living within walking distance of the officeRelocation support for those moving to San Jose (Santana Row)Various wellness benefits covering fitness, mental health, and moreDaily lunch and dinner in our officeHow we're differentEtched believes in the Bitter Lesson.
NewSenior Packaging & Power Module Engineer Dormont Manufacturing CompanySenior Packaging & Power Module EngineerSan Jose, CA$135,000–$190,000 / yearThe ideal candidate will design and develop packaging solutions for industrial, automotive, and telecom markets while collaborating with various internal teams and suppliers. Monolithic Power Systems, Inc. (MPS) is seeking a talented professional for the position of Package/Power Module and Packaging Technology Development.
Project Manager, Packaging Design Barry-Wehmiller Companies IncProject Manager, Packaging DesignModesto, CA$100,000–$150,000 / yearBy blending people-centric leadership with disciplined operational strategies and purpose-driven growth, Barry-Wehmiller has become a $3 billion organization with nearly 12,000 team members united by a common belief: to use the power of business to build a better world. Rooted in our distinct culture of Truly Human Leadership, we cultivate the leaders who will define tomorrow and partner with our clients in the food & beverage, life sciences, industrial, and advanced technology industries to build the future of manufacturing and technology.
Lab Packaging Test Engineer I Engineer In Training (Swing Shift) Ryzen SolutionsLab Packaging Test Engineer I Engineer In Training (Swing Shift)San Jose, CA$66,560Perform testing duties within the designated workday hours according to requirements to ensure customer objectives are met through proactive communication, documentation, and customer service. Maintain responsive customer communication in email and in person regarding testing services provided, test status, updates, and results.
NewPackaging Design Engineer I: 3D CAD & Prototyping TransPakPackaging Design Engineer I: 3D CAD & PrototypingSan Jose, CAKey responsibilities include collaborating with teams on CAD designs, performing site visits for product details, and ensuring design efficiency. The ideal candidate holds a Bachelor's degree in Packaging Engineering and has 2-3 years of relevant experience.#J-18808-Ljbffr.
Silicon Packaging Engineering Manager Intel CorpSilicon Packaging Engineering ManagerSanta Clara, CA$190,610–$269,100 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Minimum Qualifications: Bachelor's degree in Electrical Engineering or STEM related field with 9+ years of relevant experience OR- Master's degree in Electrical Engineering or STEM related field with 6+ years of relevant experience OR- PhD in Electrical Engineering or STEM related field with 4+ years of relevant experience.
Intern, Optical Packaging and Characterization Engineer PsiQuantum CorpIntern, Optical Packaging and Characterization EngineerMilpitas, CAOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Support image processing workflows (e.g., contrast, alignment, feature extraction) using Python or similar tools and help turn results into clear tables or simple plots.
Senior Power Integrity Engineer - LPU Packaging NVIDIA CorpSenior Power Integrity Engineer - LPU PackagingSanta Clara, CA$196,000–$310,500 / yearWe have some of the most forward-thinking and hardworking people in the world working with us and our product lines are growing fast in some of the hottest state-of-the-art fields such as Artificial Intelligence, Deep Learning, Autonomous Vehicles, and Robotics. A deep understanding of board-level PDN design, including stack-up definition, plane partitioning, and VRM placement on high-layer-count accelerator boards.
Senior Signal Integrity Engineer - LPU Packaging NVIDIA CorpSenior Signal Integrity Engineer - LPU PackagingSanta Clara, CADevelop and execute simulation flows for advanced packaging technologies, including 2.5D, 3D, and multi-die integration, with strong focus on channel loss, discontinuities, return path behavior, and crosstalk. We have some of the most forward-thinking and hardworking people in the world working for us and, due to unprecedented growth, our world-class engineering teams are growing fast.
NewSenior Packaging & Power Module Engineer Monolithic Power SystemsSenior Packaging & Power Module EngineerSan Jose, CAThis role involves designing and developing packaging technologies for various markets, including automotive and telecom. Candidates should have a BS or MS in a related field, alongside 5+ years of experience in package design and proficiency in CAD software.
NewSenior/Staff Packaging Development Engineer Dormont Manufacturing CompanySenior/Staff Packaging Development EngineerSan Jose, CA$135,000–$190,000 / yearPackage/Power Module and Packaging Technology DevelopmentEssential FunctionsDesign, develop and scale to volume production of new packages and modules for the industrial, automotive, renewable and telecom markets. Knowledge of thermal, electrical and mechanical finite FEA/CFD simulation software tools and simulation methods used for semiconductor packaging and board level applications.
Principal/ Staff Engineer, Advanced Packaging Process Integration Applied Materials IncPrincipal/ Staff Engineer, Advanced Packaging Process IntegrationSanta Clara, CAResponsibilities will include advanced packaging process integration development, program management, execute gap-analysis, risk-assessment and mitigation, and monitor and track integration process flow development to make sure integration projects are completed successfully and delivered on time. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.
Director, Pricing and Packaging Strategy McAfee, LLCDirector, Pricing and Packaging StrategySan Jose, CaliforniaFull timeReporting to the Head of Pricing and partnering closely with executive leaders across Marketing, Retention, Product, and Retail, you’ll set the vision and frameworks that govern how we price, package, and promote across every channel and stage of the customer lifecycle – from acquisition through renewal – ensuring strategic coherence while maximizing long-term value. You’ll lead a high-impact pricing function, influence executive decisions on monetization strategy, and shape how millions of customers experience McAfee – from the first marketing touchpoint, through product packaging, into renewals and win-back, and across our retail ecosystem.
Packaging Structural Design Spec 3 RR Donnelley & Sons CoPackaging Structural Design Spec 3Santa Clara, CAMust have three (3) years of experience in/with: Client engagement and interfacing directly with clients and transforming ideas into shippable products and revenue; Identifying critical elements, variables, and alternatives to develop packaging design solutions; Structural design of packaging specifically for Precision Consumer Electronics packaging; Structural design experience in consumer product, educational, publishing, retail, consumer products, technology, or pharmaceutical markets; Handling packaging, manufacturing equipment, processes, and capabilities; and Working with packaging and prototyping equipment and processes; including. Manage whole design project including design creation, quick turn prototyping of various iterations of the design for review with the client, collaborating with global design and manufacturing team in Asia and India to ensure designs are manufacturable and can be automated easily, and conduct predictive product testing and analyze test data to predict design viability.
Integrated Circuit Packaging Architect Advanced Micro Devices IncIntegrated Circuit Packaging ArchitectSan Jose, CASuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. The Role: Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
NewSenior/Staff Packaging Development Engineer Monolithic Power SystemsSenior/Staff Packaging Development EngineerSan Jose, CA$135,000–$190,000 / yearSenior/Staff Packaging Development Engineer page is loaded## Senior/Staff Packaging Development Engineerremote type: Onsitelocations: San Jose, CAtime type: Full timeposted on: Posted Todayjob requisition id: R-1032Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. Description:**Package/Power Module and Packaging Technology Development**Essential Functions:*** Design, develop and scale to volume production of new packages and modules for the industrial, automotive, renewable and telecom markets.*
NewMemory Packaging Engineer MediaTek Research LabMemory Packaging EngineerSan Jose, CA$180,000–$301,000 / yearCollaborate closely with IP, ASIC design, package design, Signal Integrity (SI), Power Integrity (PI), Thermal and modeling technologies, Product Engineering, and Test Engineering teams to enable innovative solutions. Failure Analysis: Expertise in package‑level and memory‑level failure analysis (FA), defect isolation, and driving root‑cause problem solving to improve yield and reliability.
Intern, Optical Packaging Process PsiQuantum CorpIntern, Optical Packaging ProcessMilpitas, CAOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. By leveraging the advanced semiconductor manufacturing industry-including partners like GlobalFoundries-we use the same high-volume processes that already produce billions of chips for telecom and consumer electronics.
ASIC Packaging Signal/Power Integrity Engineer (Hybrid) Cisco Systems IncASIC Packaging Signal/Power Integrity Engineer (Hybrid)San Jose, CA$152,500–$219,200 / yearBachelor''s degree in Electrical Engineering and 4+ years of relevant signal and power integrity experience, or Master''s degree in Electrical Engineering and 2+ years of relevant signal and power integrity experience, or PhD in Electrical Engineering and 0+ years of related experience, or equivalent related work experience. Cisco Silicon One is the only unifying silicon architecture in the market that enables customers to deploy the best-of-breed silicon from Top of Rack (TOR) switches all the way through web scale data centers and across service provider, enterprise networks, and data centers with a fully unified routing and switching portfolio.
Build and OS Packaging Technical Lead, Production Engineering Everpure, IncBuild and OS Packaging Technical Lead, Production EngineeringSanta Clara, CAIn this role, you will drive technical direction, raise engineering execution, and work closely with product, infrastructure, and release teams to improve build performance, reliability, and developer productivity. We have been named Fortune''s Best Workplaces in Technology, Fortune''s Best Workplaces in the Bay Area, and certified as a Great Place to Work!
Advanced Optical Packaging Design Tech Lead MediaTek IncAdvanced Optical Packaging Design Tech LeadSan Jose, CAThe ideal candidate brings deep expertise in substrate and packaging technologies, hybrid bonding, thermo-mechanical behavior, and high-speed interconnect design, and works effectively across PIC, IC, systems, reliability, manufacturing, and supplier teams. This is a highly visible technical leadership role with responsibility for package architecture, substrate design, hybrid bonding integration, warpage risk management, signal integrity, and production enablement.