NewAdvanced Packaging Dry Etch Module Development Engineer INTELAdvanced Packaging Dry Etch Module Development EngineerPortland, OR$148,100–$209,100 / yearThe successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. See Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions.
NewModule Development Engineer (Adv Packaging) INTELModule Development Engineer (Adv Packaging)Portland, OR$94,300–$133,200 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. Working closely with internal engineering teams and external suppliers, this individual will lead process development efforts, optimize manufacturing capabilities, and contribute to technology roadmaps that enable future product requirements.
Packaging American Workforce Group, Inc.PackagingWoodland, WAAmerican Workforce Group has partnered with a premier paper manufacturing facility in Woodland, WA to hire full-time Packaging Workers. Description for Packaging Worker: Inspect paper product quality across assigned high-volume production lines.
Senior Director, Pricing & Packaging Gainsight, Inc.Senior Director, Pricing & PackagingOR$215,000–$230,000 / yearThis is a great opportunity for someone who thrives in a highly strategic, data-driven SaaS environment and enjoys working cross-functionally with teams like Product, Sales, Finance, Marketing, and Customer Success. In this role, you'll play a key role in driving Gainsight's monetization strategy and long-term revenue growth by leading the evolution of pricing and packaging across its product portfolio, including the transition to usage- and value-based models.
Packaging Operator International Flavors & Fragrances IncPackaging OperatorClackamas, ORMust be able to successfully pass all job-related tests and certifications required for working in a cGMP, quality environment including but not limited to: inspections and GMP requirements to perform essential functions of the job. Maintains clean and orderly work area including: cleaning machines, breakdown of machine, tools and area around work station.
System Administrator 2 - Application Packaging & Delivery APR StaffingSystem Administrator 2 - Application Packaging & DeliveryVancouver, WA1 years’ experience packaging desktop software applications for delivery using a centralized software distribution system (Microsoft Configuration Manager or Microsoft Intune). All employment offers are contingent upon successful completion of our pre-employment screening that may include drug testing, background/criminal check, and if applicable, must meet eligibility requirements for access to classified information.
Silicon Packaging Design Engineer Intel CorpSilicon Packaging Design EngineerHillsboro, OR$105,650–$200,340 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Advanced Packaging Lithography Development Manager Intel CorpAdvanced Packaging Lithography Development ManagerHillsboro, OR$155,520–$298,440 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Foundry Services Advanced Packaging Account Technical Solutions Engineer Intel CorpFoundry Services Advanced Packaging Account Technical Solutions EngineerHillsboro, OR$220,320–$311,040 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
Packaging & Customer Support Associate NW StaffingPackaging & Customer Support AssociateTUALATIN, ORWere looking for a detail-oriented Receiving, Kitting, and Customer Service Associate who enjoys hands-on work, customer interaction, and supporting a busy electronics operation. Support daily operations by collaborating with the Inside Sales Manager, maintaining organized records, and ensuring efficient workflow and material processing.
ADCE Packaging Design Architect Intel CorpADCE Packaging Design ArchitectHillsboro, OR$220,920–$311,890 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
Clean & Packaging Technician 1 Marmon Holdings IncClean & Packaging Technician 1Hillsboro, ORFollowing receipt of a conditional offer of employment, candidates will be required to complete additional job-related screening processes as permitted or required by applicable law. As a part of the global industrial organization Marmon Holdings-which is backed by Berkshire Hathaway-you'll be doing things that matter, leading at every level, and winning a better way.
Packaging & Production Operator: American Workforce Group, Inc.Packaging & Production Operator:Columbia City, OR$18–$20 / hourMaterial Management: Facilitate the efficient placement of bags, clear compression chambers, and safely remove compressed wood bales from the machinery line. Palletization & Warehousing: Move, stack, and wrap completed heavy product bags onto pallets, apply protective covers, and stage finished goods in the correct warehouse locations.
Senior Packaging Engineer GenentechSenior Packaging EngineerHillsboro, OregonHillsboro Technical Operations (HTO) is a drug product & finished goods manufacturing organization responsible for the reliable delivery of Roche’s commercial portfolio & pipeline products. In this role you will also provide technical support for bulk packaged and finished goods shipping and distribution in the Roche network.
Sales Manager - Tablet & Capsule Packaging Systems Syntegon Technology GmbHSales Manager - Tablet & Capsule Packaging SystemsPortland, OR$120,000–$140,000 / yearServe as the primary customer liaison and coordinate Syntegon resources to define customer requirements, specify engineering solutions, recommend design modifications, and resolve technical issues to ensure high customer satisfaction and successful project delivery. Demonstrated success executing moderate- to large-value capital sales transactions under pressure, with the patience, tenacity, and professionalism required for long, complex sales cycles.
NewSales Manager Tablet Capsule Packaging Systems SYNTEGONSales Manager Tablet Capsule Packaging SystemsPortland, OR$120,000–$140,000 / yearWork closely with customer representatives to evaluate specifications, define requirements, and develop technical solutions in coordination with internal resources (e.g., Application Engineers, Syntegon resources).Collaborate closely with aftermarket/service teams to drive repeat business and long-term customer relationships. Serve as the primary customer liaison and coordinate Syntegon resources to define customer requirements, specify engineering solutions, recommend design modifications, and resolve technical issues to ensure high customer satisfaction and successful project delivery.
NewRegional Sales Manager Tablet Capsule Packaging Equipment SYNTEGONRegional Sales Manager Tablet Capsule Packaging EquipmentPortland, ORThe successful candidate will have at least 3 years of sales experience in capital equipment, a bachelor's degree in a related field, and the ability to travel up to 50% of the time. SYNTEGON in Portland, Oregon is looking for a Sales Manager to oversee the sales of imported pharmaceutical solid packaging equipment.
Packaging Engineer International Flavors & Fragrances IncPackaging EngineerOR$91,744–$114,680 / yearThe Packaging Engineer will provide technical leadership for global finished format packaging operations, including oversight of equipment, packaging materials, and inputs to contract manufacturing partners. Serve as the subject matter expert for finished format packaging equipment (bottling, blister, stick pack, sachet, etc.) and packaging materials across global operations.
NewCircularity Innovation Engineer: Packaging & Materials Hewlett Packard EnterpriseCircularity Innovation Engineer: Packaging & MaterialsVancouver, WA$116,150–$182,400 / yearHewlett Packard Enterprise is seeking a Circularity Innovation Engineer to spearhead engineering and deployment of circularity solutions in products and packaging. This role aims to enhance HP's sustainability outcomes through innovative packaging materials and integration of circularity principles in product design.
Silicon Packaging Engineering Manager Intel CorpSilicon Packaging Engineering ManagerHillsboro, OR$190,610–$269,100 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Minimum Qualifications: Bachelor's degree in Electrical Engineering or STEM related field with 9+ years of relevant experience OR- Master's degree in Electrical Engineering or STEM related field with 6+ years of relevant experience OR- PhD in Electrical Engineering or STEM related field with 4+ years of relevant experience.
Clean & Packaging Technician 1 Marmon HoldingsClean & Packaging Technician 1Hillsboro, OregonAcumed LLC As a part of the global industrial organization Marmon Holdings—which is backed by Berkshire Hathaway—you’ll be doing things that matter, leading at every level, and winning a better way. Following receipt of a conditional offer of employment, candidates will be required to complete additional job-related screening processes as permitted or required by applicable law.
NewAssembler l/Packaging UFP Industries IncAssembler l/PackagingWoodburn, ORStacks completed products in accordance with established procedures, and if required, may cover, label, and band components finished product. Assembler I is responsible for fabricating component parts or assembling the finished product according to the customer's specifications.
NewAssembler l/Packaging UFP WoodburnAssembler l/PackagingWoodburn, OregonStacks completed products in accordance with established procedures, and if required, may cover, label, and band components finished product. Assembler I is responsible for fabricating component parts or assembling the finished product according to the customer's specifications.
NewSenior Thermal & Packaging Architect - Hybrid PowerLattice TechnologiesSenior Thermal & Packaging Architect - HybridVancouver, WA$175,000–$225,000 / yearPowerlattice Technologies Inc. is seeking a hands-on technical leader in Vancouver, WA to develop innovative thermal management solutions for advanced chiplet technologies targeting AI and data center platforms. The role involves collaboration with various teams, driving thermal-mechanical co-design, and leveraging extensive experience in semiconductor thermal engineering.