Senior Materials Engineer – R&D Core Materials Engineering (Polymer) Align Technology, Inc.Senior Materials Engineer – R&D Core Materials Engineering (Polymer)San Jose, CAThis role serves as a technical owner and subject-matter expert (SME) across polymer materials, dental materials, and packaging systems, you will be responsible for material verification, qualification, validation strategy, and risk based decision making across multiple high impact programs. Align Technology, Inc. is seeking a Senior Materials Engineer with strong expertise in polymer science, sustainability, material compatibility, dental composite and adhesive, and medical device packaging to lead complex, cross-functional initiatives.
Field Mechanic - Snack Chip Cooking & Packaging Equipment - San Francisco, CA Diedre Moire Corp.Field Mechanic - Snack Chip Cooking & Packaging Equipment - San Francisco, CASF, CA$80,000–$120,000 / yearFull timeCONSIDERED EXPERIENCE INCLUDES: Field Service Technician Engineer Mechanic Tech Maintenance Install Repair Calibrate Maintain Processing & Packaging Equipment Machinery Automated Film Foil Pouchers Baggers Fillers Roasters Dry Friers Vacuum Fried Baked Snacks Potato Tortilla Chips French Fries Confection Nuts Molded Candy Molders #DiedreMoire #JobSearch #JobHunt #JobOpening #Hiring #Job #Jobs #Careers #Employment #jobposting #fieldeservicejobs #technicianjobs. Field Service Technician Engineer Mechanic Tech Maintenance Install Repair Calibrate Maintain Processing & Packaging Equipment Machinery Automated Film Foil Pouchers Baggers Fillers Roasters Dry Friers Vacuum Fried Baked Snacks Potato Tortilla Chips French Fries Confection Nuts Molded Candy Molders _.
Advanced Packaging Engineer Zp Group LlcAdvanced Packaging EngineerSaratoga, CA$200,000–$250,000 / yearKeywords: Advanced Packaging Engineer, Organic Substrates, CoWoS, TSMC, 2.5D Packaging, Flip Chip, SMT Assembly, Module Integration, Semiconductor Packaging, OSAT, Failure Analysis, Mechanical Modeling, High-Performance Computing, Networking Hardware, Saratoga CA. Responsibilities for the Advanced Packaging Engineer include: Own full lifecycle of system module packaging from architecture through high-volume production, including organic substrates, interposers, cooling, boards, and mechanical hardware.
Senior Packaging Engineer Zp Group LlcSenior Packaging EngineerSaratoga, CA$210,000–$265,000 / yearKeywords: advanced packaging, flip‑chip, multi‑chip module, MCM, organic substrate, CoWoS, 2.5D, 3D packaging, TSMC system‑on‑wafer, OSAT, Wistron, module integration, cold plate integration, wafer‑level assembly, substrate technology, semiconductor packaging, high‑density interconnect, HDI substrates, yield improvement, semiconductor manufacturing, module engineering. The ideal Senior Packaging Engineer will lead advanced component and system‑level packaging efforts, with a strong emphasis on pcb assembly and organic substrate technologies on site in Saratoga, CA.
Associate Packaging Engineer Rodan & Fields LLCAssociate Packaging EngineerSan Ramon, CA$64,000–$85,000 / yearRodan + Fields Dermatologists is a direct selling skincare company founded in 2000 by Dr. Katie Rodan and Dr. Kathy Fields, world-renowned dermatologists, and creators of Proactiv Solution with a passion for giving people the best skin of their lives - and the confidence that comes with it. With effective products, a unique business model and a powerful community of Independent Consultants, Rodan + Fields has disrupted the skincare category to become a leading skincare brand in North America.
Photonic Packaging Engineer, Principal Astera Labs IncPhotonic Packaging Engineer, PrincipalSan Jose, CAAstera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
Senior IC Packaging Engineer Axiado CorpSenior IC Packaging EngineerSan Jose, CAAxiado has also won numerous industry awards for our ground-breaking products and technological innovations, including being named one of Fast Companys 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliances 2025 Start-Up to Watch award. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management.
Sr. Associate, Packaging Engineer Method Products PBCSr. Associate, Packaging EngineerSan Francisco, CAKnowledge of the product development process and experience related to various delivery system technologies (e.g., aerosol formulation, emulsion chemistry, gel formulation, polymer chemistry, reaction products, surfactants, solvents, builders). In this role, youll help bring ideas from concept to self, developing new packaging, supporting line extensions, and driving technical innovation that keeps our products fresh, functional, and sustainable.
Senior IC Packaging Engineer Microsoft CorpSenior IC Packaging EngineerMountain View, CA$119,800–$234,700 / yearSpecific responsibilities to include: • Work with product architects to determine the optimal packaging solution • Drive package technology solutions for chiplet architecture with advanced packaging • Drive supplier assessments and manage suppliers through definition, development, qualification and production • Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options • Define, design and develop test vehicles to validate Silicon, Package, System performance • Support substrate design working with suppliers and internal teams • Assess and characterize the reliability of Integrated Circuits (IC) packages • Design and develop package and assembly drawings to support the manufacturing • Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers • Drives the execution of architecture solutions across product lines or multiple product groups and across teams that account for design trends and future concepts by leveraging cross-functional expertise, industry best practices, and lessons learned from teams working across multiple product lines • Drives engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs. Preferred Qualifications: • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience • Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience • Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience • Master's Degree with 10 years experience in semiconductor package product development • 5+ years hands-on experience in Semiconductor Package development, manufacturing, supplier management or quality management • Specific experience with Advanced Semiconductor Package technologies (e.g.
Packaging Engineer Rodan & Fields LLCPackaging EngineerSan Ramon, CA$84,000–$105,000 / yearRodan + Fields Dermatologists is a direct selling skincare company founded in 2000 by Dr. Katie Rodan and Dr. Kathy Fields, world-renowned dermatologists, and creators of Proactiv Solution with a passion for giving people the best skin of their lives - and the confidence that comes with it. With effective products, a unique business model and a powerful community of Independent Consultants, Rodan + Fields has disrupted the skincare category to become a leading skincare brand in North America.
Memory Packaging Engineer Apple IncMemory Packaging EngineerSanta Clara, CAMinimum requirement of a bachelors degree in a relevant fieldMS or PhD preferred, with 3+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages. If you are driven to solve the industrys toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.
Sr. Associate, Packaging Engineer SC Johnson Lifestyle BrandsSr. Associate, Packaging EngineerSan Francisco, CaliforniaKnowledge of the product development process and experience related to various delivery system technologies (e.g., aerosol formulation, emulsion chemistry, gel formulation, polymer chemistry, reaction products, surfactants, solvents, builders). In this role, you’ll help bring ideas from concept to self, developing new packaging, supporting line extensions, and driving technical innovation that keeps our products fresh, functional, and sustainable.
Optic-Electronic Packaging Engineer Lumentum Operations LLCOptic-Electronic Packaging EngineerSan Jose, CA$130,850–$186,900 / yearWith our continual goal of making Lumentum a best place to work for our employees, we strive to offer employees competitive total compensation packages, which may include annual bonus, commission for certain sales roles, equity, and health and welfare benefits. This role focuses on advanced mechanical and thermal packaging solutions for high-density, high-power optical modules, including pluggable form factors and emerging advanced packaging architectures.
Internship, Packaging Engineer, Supply Chain (Fall 2026) Tesla IncInternship, Packaging Engineer, Supply Chain (Fall 2026)Fremont, CA$16.35–$33.65 / hourConsider before submitting an application: This position is expected to start August 2026 or September 2026 and continue through the Fall term (ending approximately December 2026 or later, if available). Demonstrated ability to facilitate dynamic cross-functional projects with engineering, supply chain, manufacturing and test to meet project timelines.
Packaging Engineer Ursus, Inc.Packaging EngineerFremont, CA$68–$78.37 / hourWork cross-functionally with our Vehicle Engineering team, Supplier Quality organization, and Logistics team, making sure our packaging fulfills all internal customer needs. As our Packaging Engineer, you will be responsible for designing, testing, and improving the packaging used to transport our components from our supplier base to our distribution center, as well as the internal packaging within our facilities.
Principal Packaging Engineer Koch IncPrincipal Packaging EngineerFremont, CA$200,000–$280,000 / yearOur advanced optical, mechanical, electrical, and software design capabilities support the evolving needs of high-density, high-bandwidth, and flexible optical networks across telecom, datacom, hyperscale datacenters, artificial intelligence, and supercomputing. The position requires close collaboration with R&D and product design teams, manufacturing, suppliers, and customers to ensure laser components meet stringent optical, mechanical, and Telcordia reliability requirements.
Advanced Packaging Engineer DensityAIAdvanced Packaging EngineerMountain View, CA$200,000–$350,000 / year10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies. Demonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions.
Principal Packaging Engineer Skyworks Solutions IncPrincipal Packaging EngineerSan Jose, CAAt Skyworks you will find a fast-paced environment with a strong focus on global collaboration minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creative thinking. Experience in package design and proficient in Cadence Allegro platform tools, PCB Editor, Advanced Package Designer, APDSiP, or Mentor Xpedition platform tools.
Silicon Photonics & Optical Packaging Engineer Apple IncSilicon Photonics & Optical Packaging EngineerCalifornia, CAIn this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM.
Associate Optical Packaging Engineer PsiQuantum CorpAssociate Optical Packaging EngineerMilpitas, CA$85,000–$120,000 / yearOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate''s qualifications including relevant education and training, competencies, experience, geographic location, and business needs.
Lab Packaging Testing Engineer I Marquee StaffingLab Packaging Testing Engineer IUnion City, CA$30–$32 / hourSupport Internal customers departments like Engineering Services with customer support or technical expertise. They are seeking a Packaging Testing Engineer I with a background in Packaging or Mechanical Engineering that will conduct and support package testing and validation.
Senior Staff Optical Packaging Engineer Aurora Innovation IncSenior Staff Optical Packaging EngineerMountain View, CA$197,000–$285,000 / yearAurora expects commitment to our safety policies from every employee, and seeks candidates who take an active responsibility, can contribute to building an atmosphere of trust, and invest in the organization's long-term success by prioritizing working safely, no matter what. Aurora hires talented people with diverse backgrounds who are ready to help build a transportation ecosystem that will make our roads safer, get crucial goods where they need to go, and make mobility more efficient and accessible for all.
Advanced Packaging Process Engineer Tenstorrent IncAdvanced Packaging Process EngineerSanta Clara, CAPartner with design, reliability, and architecture teams to evaluate tradeoffs (bump pitch, stack-ups, embedded Si, etc.) and lead test vehicle planning to meet program needs. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.
Laser Principal Packaging Engineer - Optical Solutions R&D Koch IncLaser Principal Packaging Engineer - Optical Solutions R&DFremont, CA$200,000–$280,000 / yearOur advanced optical, mechanical, electrical, and software design capabilities support the evolving needs of high-density, high-bandwidth, and flexible optical networks across telecom, datacom, hyperscale datacenters, artificial intelligence, and supercomputing. The position requires close collaboration with R&D and product design teams, manufacturing, suppliers, and customers to ensure laser components meet stringent optical, mechanical, and Telcordia reliability requirements.
Senior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and Integration Macpower Digital Assets Edge Private LimitedSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and IntegrationSanta Clara, CA$64–$64 / hourIf you enjoy solving complex challenges in mixed-signal design, chiplet integration, and high-performance electronics, this role is for you. We are looking for a Senior Electrical Engineer with deep expertise in semiconductor design, advanced packaging, and ASIC development.
Packaging Design Engineer Google LLCPackaging Design EngineerSunnyvale, CAFrom software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. Utilize advanced Three-Dimensional/Two-Dimensional Computer-Aided Design software (SolidWorks, Artios CAD, Creo, etc.) to architect complex structural packaging solutions and generate precise technical drawings, assembly instructions, and cushion layouts.
Senior Packaging Design Engineer, Silicon Google LLCSenior Packaging Design Engineer, SiliconMountain View, CACollaborate closely with Signal integrity (SI)/Power Integrity (PI), Test, New Product Introduction (NPI) and Mechanical Engineering teams to refine and optimize product package architecture and design. 5 years of experience in chip package substrate design using Cadence APD (Allegro Package Designer) or Mentor Expedition with package tape-outs.
Advanced Packaging Engineer - SI/PI Marvell Technology IncAdvanced Packaging Engineer - SI/PISanta Clara, CA$97,630–$146,300 / yearHighlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. Expected Base Pay Range (USD) $97,630 - $146,300 per annum The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions.
Internship, Power Semiconductor Packaging Mechanical Design Engineer, Energy Engineering (Summer 2026) Tesla IncInternship, Power Semiconductor Packaging Mechanical Design Engineer, Energy Engineering (Summer 2026)Palo Alto, CA$20–$50 / hourKnowledge of various manufacturing techniques including die bonding, wire bonding, solder dispensing & printing, reflow, plasma cleaning, encapsulation, plating, stamping, die-casting, injection molding, fastening, joining, and automated assembly processes to ensure designs are productionable. Develop Tesla custom power semiconductor packages (e.g., discrete and module) for electric vehicle and energy storage products utilizing SiC, GaN, or Si technology, as well as developing novel cooling and attachment methods for Power Electronics applications.
Senior Fiber Optic Module Packaging Engineer II-VI Optical Systems, Inc.Senior Fiber Optic Module Packaging EngineerSunnyvale, CAWe are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard work through a competitive compensation program.
Packaging Assembly Engineer Apple IncPackaging Assembly EngineerCupertino, CAIn this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC. Define and optimize end-to-end FCBGA assembly process flow (wafer back-end interface, flip-chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).
Sr. Principal Engineer, Advanced Packaging Marvell Technology IncSr. Principal Engineer, Advanced PackagingSanta Clara, CAThe group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Principal Packaging Engineer Delos DataPrincipal Packaging EngineerPalo Alto, CaliforniaSelect and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability. We aim to create an environment where people are treated fairly, supported in their growth, and are empowered to do meaningful work alongside others who take the craft seriously.
Senior Engineer, Semi Packaging Engineering Analog DevicesSenior Engineer, Semi Packaging EngineeringSan Jose, CaliforniaRequirements: Must have a Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, Autonomy and Robotics Engineering, or related field (willing to accept a foreign education equivalent) and two (2) years of experience as a Packaging Engineer or related occupation conceptualizing and productizing semiconductor devices to bridge analog signals to digital Cloud. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
Packaging Product Design Engineer Apple IncPackaging Product Design EngineerCupertino, CACollaborate with cross-functional teams including industrial design, hardware, environmental, operations, and technology groups to refine and execute on the design on the packaging. Apple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
Software Engineer 5 - Ads Pricing & Packaging Netflix IncSoftware Engineer 5 - Ads Pricing & PackagingLos Gatos, CA$388,000–$619,000 / yearThe Ads Pricing and Packaging team is responsible for developing cutting-edge inventory management systems which support various monetization strategies, including dynamic pricing, rate card management, product packaging, inventory segmentation, and yield optimization. Skills & experience we're seeking: Professional experience in building inventory management solutions that support monetization strategies such as dynamic pricing, rate card management, product packaging, inventory split and yield management.
Supplier Industrialization Engineer, IC Packaging, Power Electronics Tesla IncSupplier Industrialization Engineer, IC Packaging, Power ElectronicsPalo Alto, CA$85,760–$197,160 / yearOwner of RFQ's and contract management - ensure Non-Disclosure Agreements, General Terms & Conditions, Piece Price Agreements, and other related contracts are negotiated, agreed and appropriately documented before business is initiated. Along with competitive pay, as a full-time Tesla employee, you are eligible for the following benefits at day 1 of hire: Aetna PPO and HSA plans > 2 medical plan options with $0 payroll deduction.
Chip Packaging Architect Google LLCChip Packaging ArchitectSunnyvale, CAYou will collaborate with product architects, design teams, and Signal Integrity/Power Integrity (SI/PI), thermal, mechanical, assembly, and Printed Circuit Board (PCB) engineers to create high-performance packages. As a Chip Packaging Architect on our Silicon Integration team, you will drive advanced packaging solutions (2.5D/3D/3.5D) and technologies for Machine Learning (ML) chips and custom Application-Specific Integrated Circuits (ASICs).
Sr. Packaging Engineer NEXTracker IncSr. Packaging EngineerFremont, CA$160,000–$175,000 / yearThis role goes beyond traditional packaging design, focusing on end-to-end packaging systems, including returnable packaging, reverse logistics, cost modeling, and network-wide performance. Our talented worldwide teams are redefining how solar power plants are designed, built, and operated every day with smart technology, data-driven insights, and advanced automation.
Optical Packaging and Component Engineer Marvell Technology IncOptical Packaging and Component EngineerSanta Clara, CAHighlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
Packaging Engineer - Inductor and Power Module Texas Instruments IncPackaging Engineer - Inductor and Power ModuleSanta Clara, CAExperience with Material Characterization (ex; BH analyzer, VSM, SEM, EDX) • Experience in advanced co-packaged power modules • Preferred qualifications: • PhD in Electrical Engineering, Materials Science, or a related field with deep focus on magnetics and power packaging • System-level understanding of power delivery architectures, thermal management, EMI, and reliability constraints • In-depth understanding of magnetic materials: Ferrite materials (NiZn MnZn), metal materials (Fe, FeNi, FeSiCr, FeSiAl, amorphous & nano crystalline materials) • Familiarity with high-frequency magnetic material behavior, loss modeling, and reliability testing • Hands on knowledge of simulation tools and techniques like Maxwell, Ansys, Femtet, homogenization and model order reduction, optimization tools (NN, AI/ML) • Understanding of material processing: ceramic, metal powder and composite materials • Familiarity with inductor coil forming and termination processes: wire wounded, multilayer, metal composite, thin film, etc. Responsibilities may include: • Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure.
Advanced Packaging Multi-Physics Modeling Engineer OpenAIAdvanced Packaging Multi-Physics Modeling EngineerSan Francisco, CaliforniaFor unincorporated Los Angeles County workers: we reasonably believe that criminal history may have a direct, adverse and negative relationship with the following job duties, potentially resulting in the withdrawal of a conditional offer of employment: protect computer hardware entrusted to you from theft, loss or damage; return all computer hardware in your possession (including the data contained therein) upon termination of employment or end of assignment; and maintain the confidentiality of proprietary, confidential, and non-public information. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI.
Memory Packaging Engineer MediaTek IncMemory Packaging EngineerSan Jose, CACollaborate closely with IP, ASIC design, package design, Signal Integrity (SI), Power Integrity (PI), Thermal and modeling technologies, Product Engineering, and Test Engineering teams to enable innovative solutions. Roles and Responsibilities: Supports MediaTek's Memory packaging technology development including but not limited to HBM package, cHBM, LPDDR package for mobile applications, In Package Memory (IPM) for Edge AI, etc.
Senior Reliability Engineer - LPU Packaging NVIDIA CorpSenior Reliability Engineer - LPU PackagingSanta Clara, CAOwn the package-level reliability spec for assigned products • Define qualification requirements and pass/fail criteria for device/package-level reliability (e.g., HTSL, TCT, UHAST, pre-conditioning, JESD22 methods) and Package-on-board / board-level reliability (thermal cycling, shock/vibration, connector/cage interactions) • Leads materials and stackup selection (substrate, solder alloy, underfill, mold, lid, TIM, etc.) and DFR trade-offs for new packages and 2nd sources • Evaluates thermo-mechanical and SI/PI impact of those choices • Analyzes qual and stress data (including HTOL, package qual, SLT/system stress) and convert to design / process/ material changes for next revision • Understands how the component FIT rolls up from component level to system level and overall availability requirement. • Demonstrated ability to lead cross-functional efforts across design, package R&D, SI/PI, validation, QA, and operations • Experience with data center or cloud hardware and understanding of: • Rack and cluster-level availability targets and constraints • How component FIT drive sparing, repair rate, and availability planning • Strong communication: Able to present trade-offs and reliability risks clearly to both technical and program stakeholders.
Foundry Services Advanced Packaging Account Technical Solutions Engineer Intel CorpFoundry Services Advanced Packaging Account Technical Solutions EngineerSanta Clara, CA$220,320–$311,040 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
Senior Technical Solutions Engineer - Advanced Packaging Intel CorpSenior Technical Solutions Engineer - Advanced PackagingSanta Clara, CA$160,980–$311,040 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Packaging Product Design Engineering Manager Apple IncPackaging Product Design Engineering ManagerCupertino, CAApple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials. As a Packaging PD Manager, you will lead a team of engineers to design and execute packaging architecture from initial prototypes to mass production with sustainable packaging material.
Laser Principal Packaging Engineer - Optical Solutions R&D MolexLaser Principal Packaging Engineer - Optical Solutions R&DFremont, CAFull timeOur advanced optical, mechanical, electrical, and software design capabilities support the evolving needs of high-density, high-bandwidth, and flexible optical networks across telecom, datacom, hyperscale datacenters, artificial intelligence, and supercomputing. The position requires close collaboration with R&D and product design teams, manufacturing, suppliers, and customers to ensure laser components meet stringent optical, mechanical, and Telcordia reliability requirements.
Cloud Hardware Development, Packaging, Network Product Development - Optics Amazon.com IncCloud Hardware Development, Packaging, Network Product Development - OpticsCupertino, CAYou will perform high-quality design, development, validation, and sustaining engineering of IC and SOC packages for high-speed applications, working closely with design teams, manufacturing partners, and cross-functional stakeholders to deliver robust solutions at scale. Within AWS Networking the NPD (Network Product Development) organization is responsible for, designing the hardware, building the software, and owning the interconnects for the routers that power the global AWS network.
Senior Optical Packaging Process Engineer PsiQuantum CorpSenior Optical Packaging Process EngineerPalo Alto, CA$160,000–$180,000 / yearOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate's qualifications including relevant education and training, competencies, experience, geographic location, and business needs.