In this role, you will be responsible for the design, modeling, layout, post-fabrication assembly, sub-system assembly, and benchtop test of RF integrated photonics (PIC) devices/components, subsystems, and systems in support of research and development programs. Contribute to post-fabrication post-processing/assembly, test setup, and benchtop test of integrated photonic components, subsystems, and systems in coordination with senior technical and program leadership.