You will partner closely with silicon architecture, SerDes/IP teams, package design, PCB design, hardware validation, manufacturing, substrate vendors, and OSAT partners to optimize signal integrity, power delivery, substrate/interposer routing, bump planning, and system-level electrical performance while balancing cost, manufacturability, reliability, yield, and schedule. Own SIPI simulation and signoff for advanced packaging platforms, including chiplet-based packages, 2.5D/3D integration, silicon interposers, and bridge-based interconnect, by leading simulations for D2D interconnect (e.g., UCIe), multi-die PDN, micro-bump modeling, TSV/interposer modeling, and multi-die CPM co-simulation.