We also train individuals possessing desired traits and characteristics such as clarity of thought, excellent communication skills, ability to learn, mental flexibility, emotional maturity, personal leadership qualities, goal driven, ambition, hardworking, dedicated, committed, good attitude, willingness to work Overtime, Quality Driven while meeting throughput expectations, customer focused, high attention to detail, team oriented and strong initiative. Metals Deposition / Thin Films, Plasma Dry Etch, Wet Etch, Mounting/Grinding Wafers and Photolithography experience is preferred, but will train the right person with semiconductor/wafer fab experience in other areas of the fab.