Performs general assembly operations under the GL with minimal technical supervision, including, but not limited to, printed wire board assembly, conformal coating, potting, ultrasonic cleaning, coil winding, evac & backfill, component forming, wire wrapping, painting, assembly mechanism timing or shimming, and fabrication of rigid and semi-rigid cable assemblies as required by program or process. Attain security clearance and maintain certifications as required by programs or process such as ESD, explosive handling, explosive lead install, molykote, brazing, D17.1 welding, and soldering (IPC J-STD-001) including general, wire, printed wire board, wave, induction, surface mount, and critical disk head soldering as required.