Conduct visual inspections for scratches, cracks, delamination, corrosion, voids, contamination, cosmetic nonconformances, and PCB/SMT workmanship defects, including tombstoned components; cold, bridged, cracked, or disturbed solder joints; excess or insufficient solder; solder icicles or spikes; lifted pads; land damage; and conductor nicks, cuts, or thinning. Use low- and high-magnification microscopy to inspect bonding pads, traces, vias, and surface features for conditions such as annular ring breakout, delamination or blistering, over- or under-etching, via plating voids, PCB warpage, component misalignment, solder balls, and solder splatter.