Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability). Required Qualifications Qualified candidates will have experience in two or more of the following (the capacity to understand and determine current limitations as well as future improvements is preferred): Microelectronics Supply Chain: microelectronics hardware verification/security/trust/assurance, vendor selection, qualification, audit, procurement (i.e. domestic foundry interaction).