Experience with electronics packaging and heterogeneous integration, such as PCB-embedded modules, DBC/AMB substrates, die attach, wire or ribbon bonding, flip-chip assembly, or comparable assembly methods with ability to drive electrical, thermal, and mechanical co-design for robust, scalable package solutions. Innovate, fabricate, assemble, and integrate heterogeneous packaging prototypes and test samples, including PCB-embedded modules, DBC/AMB substrates, wide-bandgap SiC/GaN devices, and electronic–photonic co-packaged concepts.