You will own investigations from initial non-destructive analysis through destructive physical analysis, determine the appropriate characterization technique for each problem, translate findings into actionable root cause and corrective actions, and feed learnings back into product design, packaging, manufacturing, and supplier processes. Develop FA workflows using the appropriate progression of non-destructive and destructive analytical techniques, including optical microscopy, X-ray/CT, SAM, IR imaging, cross-sectioning, FIB, SEM/EDS, XPS, XRD, and related methods.