Responsibilities: Lead transition of TEN hardware from development to the next generation, small form factor Ensure compliance with Design for Manufacturability (DFM), Design for Test (DFT), and Design for Reliability (DFR) principles for ruggedized edge systems Support design and integration of high-performance compute hardware (CPU/GPU systems, storage, networking, sensor interfaces) Develop production processes, test procedures, and acceptance criteria for deployed systems Troubleshoot hardware and system-level issues across lab, production, and fielded environments Perform root cause corrective action (RCCA) on failures identified during test or deployment Support environmental qualification (thermal, vibration, shock, EMI/EMC) for tactical deployments Manage configuration control, technical data packages (TDPs), and engineering change orders (ECOs) Collaborate with software, network, and ISR system teams to ensure hardware compatibility and performance Interface with DoD stakeholders, program offices, and operational users to support deployment readiness. Required Skills and Experience: 6-10+ years of experience in hardware engineering, production engineering, or systems integration Experience with ruggedized computing systems or deployed tactical hardware Strong understanding of embedded systems, networking hardware, and high-performance compute platforms Experience with electronics manufacturing (PCB assembly, system integration, box build) Hands-on troubleshooting experience with lab and field equipment Demonstrated ability to lead cross-functional engineering and production efforts Hardware-to-production transition for tactical systems Ruggedized system design & integration Production troubleshooting & RCCA Systems-level thinking (compute, network, sensors) Cross-functional leadership Data-driven manufacturing & reliability improvement.