The majority of this role’s hands-on time is spent operating the thin film and etch modules (PECVD dielectric deposition systems, ICP/RIE dry etch systems, and wet etch benches) to keep volume production lots moving on schedule, including the dielectric mask, Mesa etch, and surface preparation steps that support MOCVD epitaxial regrowth of InP current-blocking layers used to form the buried heterostructure, as well as dielectric passivation of the finished device. The Wafer Fab Process Technician serves as a key production and technical leader whose primary responsibility is running volume production in support of daily wafer fabrication schedules, while also ensuring process stability, recipe control, and yield performance across InP photonic device lines, specifically InP Buried Heterostructure (BH) DFB lasers and BH Gain Chips (GC).