You'll collaborate in a multidisciplinary environment (EE, ME, materials, computer science, and research staff) to: Package and protect die-level and PCB assemblies using polymerics (adhesives, staking, encapsulation, underfills) and metals (solder alloys, sintered joints), Model stresses and failure modes (thermal, electrical, mechanical, vibration), Execute rigorous lab and field test campaigns (THB, temperature cycling, vibration, dielectric strength, partial discharge), and. Conduct FEA/Multiphysics modeling in ANSYS Workbench or COMSOL for thermal stress, mechanical stress, electrical stress, and vibration/modal analysis; propose mitigations (stiffeners, damping, isolation, fasteners, fillets/chamfers, materials).