Responsibilities: Performs general assembly operations under direct supervision of the GL, including, but not limited to, printed wire board assembly, conformal coating, potting, ultrasonic cleaning, coil winding, evac & backfill, component forming, wire wrapping, and painting as required by program or process. Attain security clearance and maintain certifications as required by programs or process such as ESD, explosive handling, and general soldering (IPC J-STD-001).