Collaborate closely with IP, ASIC design, package design, Signal Integrity (SI), Power Integrity (PI), Thermal and modeling technologies, Product Engineering, and Test Engineering teams to enable innovative solutions. Your team's mission is to solve complex integration challenges (CoWoS, EMIB, SoIC, HBM, FCBGA, FCCSP, HBPOP) and lead the packaging roadmap from concept through to mass production.