Experience in running, supporting, troubleshooting, fixing, and resolving line issues with some of the following Circuit Card Assembly Cells: SMT Prep, Mag-Load, Fuji SMT, SPI, Reflow Ovens, Through Hole, Hand Assembly, Selective Solder, Wave Solder, Bonding, Conformal Coating, DePanel, Final Assembly, and Box load. Experience in supporting and programming some of the following CCA assembly equipment: Glue Machine, Laser Etcher, SPI, Fuji AIMEX III SMT, AOI, Xray, AXI, Press Fit, Trace Cut, Aqueous Wash, Conformal Coating, PVA, Selective Solder, Wave Solder, and BGA Rework.