Skills: Change Management, Change Management, Cross-Functional Leadership, Data Analysis, Defect Identification, Defect Reduction, Design of Experiments (DOE), Electrical Testing, Electroplating, Etching, Manufacturing Execution Systems (MES), Metrology, Microelectromechanical Systems (MEMS), New Product Introduction (NPI), People Leadership, Photolithography, Probe Cards, Process Control, Process Integration, Root Cause Analysis (RCA), Semiconductor Manufacturing, Stakeholder Management, Statistical Process Control (SPC), Team Development, Technology Transfer {+ 1 more}. This role ensures that complex, multi-step manufacturing processes, spanning wafer-level fabrication, MEMS processes, assembly, interconnect, and electrical test, are effectively integrated to achieve product performance, yield, quality, and manufacturability targets.