Materials Characterization: Operate sophisticated analytical tools to support Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDS), Fourier-Transform Infrared Spectroscopy (FTIR), and Thermal Analysis platforms (DSC/TGA/DMA/TMA). * Sample Preparation: Execute precise sectioning, mounting, grinding, and polishing of metal alloys, composites, and electronics assemblies for microstructural analysis.