Module Engineering PhD Intern - Wet Etch Intel CorpModule Engineering PhD Intern - Wet EtchHillsboro, OR$120,898–$120,902 / yearWorking alongside experienced engineers, you will gain hands-on exposure to state-of-the-art semiconductor fabrication technologies while helping solve complex technical challenges that drive manufacturing excellence. As a Module Engineering Intern, you will support process and equipment improvements, analyze manufacturing performance, and collaborate across engineering disciplines to enhance process capability, yield, quality, and operational efficiency.
Packaging Module Development Engineer Intel CorpPackaging Module Development EngineerChandler, AZ$133,800–$188,890 / yearEstablishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods. Job Details: Job Description: The Packaging Module Development Engineer develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Neuromorphic Front-End Silicon Lead Intel CorpNeuromorphic Front-End Silicon LeadFolsom, CA$220,920–$311,890 / yearThis principal-level role calls for a talented technical leader with a track record of realizing new processor and accelerator architectures, plus strong SoC integration experience including high-speed interfaces such as Ethernet, PCIe/UCIe, and memory controllers. Our Loihi series of research chips pioneered event-driven, sparse, and massively parallel neuro-inspired processing, fueling over 100 peer-reviewed publications that validate the promise of this novel approach.
Senior Reliability PDK and TFM engineer Intel CorpSenior Reliability PDK and TFM engineerFolsom, CA$149,600–$284,580 / yearTo support Intel Foundry strategy, we are looking for talents to join this exciting journey to drive design enablement in quality and reliability area on Intel leading technology nodes to build industry competitive design platform supporting customer design on Intel Si and package technologies. Experience and knowledge on reliability verification and physics, such as aging including BTI (Bias Temperature Instability) and HCI (Hot Carrier Injection), Electro-Migration, high voltage design, EOS (Electrical Over-Stress), ESD (Electrostatic Discharge).
Silicon SoC Architect Intel CorpSilicon SoC ArchitectAustin, TX$220,920–$361,480 / yearDevelop, execute, and analyze tests, test plans, and testing infrastructure to validate new architectures and features, using advanced statistics and data analysis to benchmark performance and identify improvements. By innovating new architectural approaches and mentoring other technical leaders, you will play a pivotal role in delivering leadership solutions that power the world's most impactful technologies.
Silicon SoC Architect Intel CorpSilicon SoC ArchitectHillsboro, OR$220,920–$361,480 / yearDevelop, execute, and analyze tests, test plans, and testing infrastructure to validate new architectures and features, using advanced statistics and data analysis to benchmark performance and identify improvements. By innovating new architectural approaches and mentoring other technical leaders, you will play a pivotal role in delivering leadership solutions that power the world's most impactful technologies.
Tool Install & Qualification Project Manager Intel CorpTool Install & Qualification Project ManagerHillsboro, OR$52,000–$200,000 / yearCandidates must meet one of the following: Bachelor's Degree in Engineering, Architecture, Construction Management, Business or related field with 1+ years of experience in Project Management, as Equipment/Engineering Tool Owner, or equivalent installation/qualification/demo/maintenance technician experience. As a Tool Install & Qualification Project Manager, you will lead the planning, coordination, installation, and qualification of semiconductor manufacturing equipment while ensuring projects are delivered safely, efficiently, and on schedule.
Physical AI Industry Solutions Manager Intel CorpPhysical AI Industry Solutions ManagerAlbuquerque, NM$188,330–$311,040 / yearAs a trusted solutions advisor, you will work directly with cloud service providers, systems integrators, software ecosystem partners, and enterprise customers to identify opportunities, develop strategic partnerships, and drive deployment of Physical AI solutions powered by Intel technologies. What we need to see (Minimum Qualifications): Bachelor's degree in Computer Science, Computer Engineering, Robotics, or related STEM degree and 6+ years' experience, Master's degree in Computer Science, Computer Engineering, Robotics, or related STEM degree and 4+ years' experience, or PhD.
NMSI F11X Thin Films Module Engineer-Technologist IntelNMSI F11X Thin Films Module Engineer-TechnologistRio Rancho, New MexicoIntel's Advanced Packaging organization bridges the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), enabling the successful deployment of advanced technology nodes and process capabilities for product qualification and high-yield manufacturing. D. in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with research publications, patents, or other demonstrated technical contributions in thin-film technologies, and 5+ years of semiconductor industry experience focused primarily on thin-film processes.
Sales and Marketing - Intern, Graduate IntelSales and Marketing - Intern, GraduateHillsboro, CaliforniaExperience or interest in customer needs analysis, market intelligence, Power BI or similar data visualization tools, sales enablement, CRM tools, marketing technologies, product knowledge, industry and engineering concepts, and emerging technologies such as AI and agentic AI. Whether you're tackling engineering challenges, improving operations, analyzing data, advancing next-generation technologies, or supporting global customers, you'll build valuable skills while contributing to innovations that enable a more sustainable and connected future.
NewQuantum Packaging Signal/Power Integrity (SI/PI) Engineer IntelQuantum Packaging Signal/Power Integrity (SI/PI) EngineerHillsboro, OregonWe're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors.
Senior Reliability PDK And TFM Engineer Intel Corp.Senior Reliability PDK And TFM EngineerFolsom, CA$149,600–$284,580 / yearTo support Intel Foundry strategy, we are looking for talents to join this exciting journey to drive design enablement in quality and reliability area on Intel leading technology nodes to build industry competitive design platform supporting customer design on Intel Si and package technologies. Experience and knowledge on reliability verification and physics, such as aging including BTI (Bias Temperature Instability) and HCI (Hot Carrier Injection), Electro-Migration, high voltage design, EOS (Electrical Over-Stress), ESD (Electrostatic Discharge).
Adce Packaging Design Architect Intel Corp.Adce Packaging Design ArchitectHillsboro, OR$220,920–$311,890 / yearExperience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx). Additional Locations: US, California, Folsom, US, California, Santa Clara, US, Colorado, Fort Collins, US, Massachusetts, Beaver Brook, US, New Mexico, Albuquerque, US, Oregon, Hillsboro, US, Texas, Austin, US, Washington, Multiple Cities.
Senior Member Of Technical Staff, Thin Films Engineer Intel Corp.Senior Member Of Technical Staff, Thin Films EngineerPhoenix, AZ$155,520–$298,440 / yearWe bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers. About This Role: Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a senior technical leader driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing.
Adce Packaging Design Architect Intel Corp.Adce Packaging Design ArchitectAustin, TX$220,920–$311,890 / yearExperience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx). Additional Locations: US, California, Folsom, US, California, Santa Clara, US, Colorado, Fort Collins, US, Massachusetts, Beaver Brook, US, New Mexico, Albuquerque, US, Oregon, Hillsboro, US, Texas, Austin, US, Washington, Multiple Cities.
Software Development Engineer IntelSoftware Development EngineerFolsom, California$100,550–$194,270 / yearAnnual Salary Range for jobs which could be performed in the US: $100,550.00-194,270.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Experience with Azure database services (Azure SQL Database, Azure Database for MySQL/PostgreSQL, Cosmos DB).
Senior Staff Process Integration Development Engineer Intel CorpSenior Staff Process Integration Development EngineerChandler, AZ$155,520–$298,440 / yearWe bridge the critical gap between Technology Development (TD) and High Volume Manufacturing (HVM), advancing technology nodes from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers. Partner with integration, process engineering, and manufacturing teams to design and deploy scalable data analytics infrastructure that enables world-class inline monitoring, process control, and rapid excursion detection.
Parametric Test Module Intern Intel CorpParametric Test Module InternHillsboro, OR$120,898–$120,902 / yearYou will be part of a module team performing electrical measurements (Etest) on chips that are mid-process inside the wafer factory (fab), providing time-critical feedback for process development and monitoring of leading-edge transistor technologies. In the Etest (parametric test) module role, you will contribute to achieving key milestones in manufacturing readiness on leading nodes, including development of automated data summaries and response flow checklists for equipment errors.
Advanced Packaging Integration and Simulation Intern Intel CorpAdvanced Packaging Integration and Simulation InternHillsboro, OR$120,898–$120,902 / yearEnabling novel system architecture, developing innovating process integration and establishing predictive physics-based simulation capabilities are critical for enabling complex large form factor packages with high-bandwidth interconnect. Support advanced packaging integration activities across wafer-level and package-level process flows, including wafer level process, 2.5D/3D integration, chiplet integration, and hybrid bonding-related modules.
AutoTEM technician Intel CorpAutoTEM technicianHillsboro, OR$63,090–$89,060 / yearConducts engineering tasks and detailed technical procedures to perform sample preparation or imaging using advanced focused-ion-beam and/or transmission electron microscope tools in support of the research and development activities of Intel. Qualifications: Candidate must possess at least one of the following: • Associate''s or Bachelor''s degree in a Technical Area (Electrical, Mechanical, Electronics Technology, Material Science or comparable field).