The position spans SOIC, lead-frame, QFN, LGA, BGA, and WLCSP package technologies and requires close collaboration with R&D, device and process engineering, module design, program management, operations, internal assembly sites, and outsourced semiconductor assembly and test partners. Lead end-to-end product readiness and the transition from development to production release, coordinating Design, Process, Test, Operations, and Module teams to meet quality, performance, and schedule objectives.