be key unit process focal point coordinating and communicating with all affected areas, including operations, maintenance, and process integration teams, maintain and improve process capability, lot quality, and operations efficiency, define and implement statistical process control; respond to process shifts, excursions, misprocess events, and tool downs, coordinate with process integration owners and develop new unit process steps as needed, create and maintain required process procedures and documentation, work with maintenance to maintain and improve equipment performance and capability. Knowledge and experience in one or more of the following process areas is preferred: physical vapor deposition, epitaxy, atomic layer deposition, chemical vapor deposition (CVD), chemical mechanical polish (CMP), ion implantation, reactive ion etch, wet processing, thermal oxidation, lithography, silicon wafer thinning, or wafer bonding.