Working alongside experienced mechanical, thermal, electrical, firmware, and system engineers, the intern will help develop reliable cooling and mechanical solutions for compute-intensive platforms containing CPUs, GPUs, memory, storage, power supplies, and high-speed I/O devices. Please note that Hewlett Packard Enterprise (HPE), its direct and indirect subsidiaries and affiliated companies, and its authorized recruitment agencies/vendors will never charge a candidate a registration fee, hiring fee, or any other fee in connection with its recruitment and hiring process.