The successful candidate will be an expert in both surface mount technology (SMT) and through hole soldering, with a proven track record of removing, repairing, and replacing a wide variety of components-including bottom terminated parts such as QFNs, BGAs, and LGAs. Execute removal, replacement, and repair of bottom terminated components (QFNs, BGAs, LGAs) using hot air pencils, hot plates, and other rework tools.