Familiarity with Robotic / Automated handling systems & High vacuum systemsDirect experience with one or more of the following types of Semiconductor Fabrication Equipment: Advanced Semiconductor Packaging, Fan Out Wafer Level Packaging, Hybrid Bonding, Photolithography, Wafer Bonding, Wet Etch, Metrology, Electroplate, PVD, CVD, Dry Etch, CMP, Advanced Packaging and Test equipment. 2 Year Technical/Associates Degree in Science, Math, Engineering, Semiconductor Manufacturing or a related discipline or equivalent military training or work experience.5+ Years of Semiconductor Equipment ExperienceDemonstrated expertise in performing electro\mechanical\fluidic circuit troubleshooting, repair, preventative maintenance, and equipment modification.