Working across Data Center Facility Engineering, Construction, Network Architecture, CAD/BIM Spatial Modeling, Supply Chain, and AI/ML New Product Introduction (NPI) teams, you will translate high-density compute, liquid cooling, power distribution, structural, and optical network fabric requirements into production-ready server hall rack layouts, manage in-flight design changes, and apply AI-enabled automation to accelerate regional capacity delivery. Drive multi-phase spatial, chip-agnostic, and chip-specific server hall layout execution for third-party colocation (3PDC) and modular facilities evaluating architectural and Mechanical, Electrical, and Plumbing (MEP) drawings across column grids, clear heights, rolling hot/cold aisle containment, and long-lead power/cooling equipment gates.