Duties and Responsibilities Lead the development and optimization of manufacturing processes of thin film lithium niobate photonic integrated circuits Drive process integration and improvement initiatives to enhance device performance and yield Work closely with the process team in the cleanroom to optimize associated metrology measurements in the fabrication flow of TFLN chips Collaborate with stakeholders across the manufacturing organization, including the design and measurement teams, to deliver high-quality photonic integrated circuits Utilize advanced metrology tools, such as CD, SEM, AFM, ellipsometry, profilometry, XPS, XRD, and optical interferometry, for process characterization and defect analysis Troubleshoot process deviations, particle contamination, and performance issues, and implement corrective actions and continuous improvement strategies Support high-priority customers throughout the design, fabrication, and testing phases of their projects. D. in Materials Science, Electrical Engineering, Physics, or related field 5 years of experience in process engineering Strong background in measurement and design of photonic integrated circuits Hands-on experience with metrology tools, such as CD, SEM, alignment, film thickness characterization, particle measurement, for process verification and defect analysis Strong problem-solving skills with experience in data analysis, SPC, and DOE Ability to work in a cleanroom environment and interface with cross-functional engineering teams Must have or be able to obtain a US DoD Security Clearance.