Responsibilities may include but not be limited to: Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification. 1+ years of experience in one or more of the following areas: AFM, and x-ray analysis/diffraction (TXRF, XRF, XRD/XRR), surface analysis (XPS, SIMS/TOFSIMS), electron spectroscopy and imaging (SEM/TEM/EDX), and FIB techniques is highly desired.